Display device having an input sensing unit

ABSTRACT

A display device includes a display panel and an input-sensing unit located on the display panel. The input-sensing unit includes a plurality of sensor portions. At least one of the sensor portions is different from the others in terms of area or distance.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.16/053,477, filed on Aug. 2, 2018, which claims priority to and thebenefit of Korean Patent Application No. 10-2017-0103237, filed on Aug.14, 2017, in the Korean Intellectual Property Office, the entirecontents of each of which are hereby incorporated by reference.

BACKGROUND

The present disclosure relates to a display device, in which aninput-sensing unit capable of sensing a touch event from a user isprovided.

Various display devices are being developed for use in multimediadevices such as televisions, mobile phones, tablet computers, navigationsystems, gaming machines, and the like. A keyboard or mouse may be usedas an input device of the display device. In certain embodiments, aninput-sensing unit may be used as the input device of the displaydevice.

The input-sensing unit may be configured to sense whether an object(e.g., a finger of a human) is in contact or touch with a screen of thedisplay device. In the input-sensing unit, a touch event may be detectedby various methods (e.g., a resistance-layer method, a photo-sensingmethod, a capacitance-sensing method, and an ultrasonic wave sensingmethod). In the capacitance-sensing method, a change in capacitance,which is caused when the object is touching the screen of the displaydevice, is used to determine whether a touch event occurs.

SUMMARY

Some embodiments of the inventive concept provide a display deviceincluding an input-sensing unit, in which capacitance between sensors isuniform.

According to some embodiments of the inventive concept, a display devicemay include a display panel and an input-sensing unit on the displaypanel.

In some embodiments, the input-sensing unit may include a plurality offirst electrodes extending in a first direction and a plurality ofsecond electrodes extending in a second direction crossing the firstdirection.

In some embodiments, each of the plurality of first electrodes mayinclude a plurality of first sensor portions and a plurality of firstconnecting portions connecting the plurality of first sensor portions toeach other, and each of the plurality of second electrodes may include aplurality of second sensor portions and a plurality of second connectingportions connecting the plurality of second sensor portions to eachother.

In some embodiments, the plurality of first sensor portions of one ofthe plurality of first electrodes may include a first normal sensorportion having a first area and being spaced apart from an adjacent oneof the second sensor portions by a first distance and a first severedsensor portion having a second area smaller than the first area andbeing spaced apart from an adjacent one of the second sensor portions bya second distance that is smaller than the first distance.

In some embodiments, the first severed sensor portion may have a shapewhich can be made by removing a portion of a shape of the first normalsensor portion.

In some embodiments, the second area may be less than or larger thanhalf the first area.

In some embodiments, the plurality of first sensor portions of the oneof the first electrodes may include a plurality of the first normalsensor portions, and the plurality of the first normal sensor portionsmay be arranged in the first direction. The first severed sensor portionmay be placed outside the plurality of the first normal sensor portionsin the first direction.

In some embodiments, the display device may further include an opticaldummy electrode located between the plurality of first sensors and theplurality of second sensors and electrically disconnected from theplurality of first sensors and the plurality of second sensors. A widthof the optical dummy electrode between the first severed sensor portionand the second sensor portion adjacent to the first severed sensorportion may be smaller than a width of the optical dummy electrodebetween the first normal sensor portion and the second sensor portionadjacent to the first normal sensor portion.

In some embodiments, a length from an end of the first severed sensorportion to another end of a first sensor portion adjacent to the firstsevered sensor portion measured in the first direction may be smallerthan a length from an end of a first normal sensor portion of theplurality of normal sensor portions to another end of a first sensorportion adjacent to the first normal sensor portion measured in thefirst direction, and an area of the first sensor portion adjacent to thefirst severed sensor portion may be substantially the same as the secondarea.

In some embodiments, the plurality of first electrodes may includeanother first electrode with a length in the first direction that isdifferent from a length in the first direction of the one of the firstelectrodes, and which includes a plurality of first sensor portions. Theplurality of first sensor portions of the another first electrode mayinclude a second normal sensor portion having the first area and asecond severed sensor portion having a third area different from thefirst area and the second area.

In some embodiments, an end of the first severed sensor portion may beconnected to an end of an adjacent one of the plurality of first sensorportions of the one of the first electrodes by a corresponding one ofthe first connecting portions, and an end of the second severed sensorportion may be connected to an end of an adjacent one of the pluralityof first sensor portions of the another first electrode by acorresponding one of the first connecting portions. A length fromanother end of the first severed sensor portion to another end of theadjacent one of the plurality of first sensor portions of the one of thefirst electrodes may be smaller than a length from another end of thesecond severed sensor portion to another end of the adjacent one of theplurality of first sensor portions of the another first electrode.

In some embodiments, the third area may be half the first area.

In some embodiments, the display device may further include an auxiliaryelectrode connected to the first severed sensor portion. A side edge ofthe auxiliary electrode may face a side edge of the second sensorportion adjacent to the first severed sensor portion.

In some embodiments, the auxiliary electrode may have a rod shape, and alength of the auxiliary electrode may be smaller than a width of thenormal sensor portion.

In some embodiments, the input-sensing unit may further include aplurality of signal lines, which are connected to the plurality ofsecond electrodes, and a compensation electrode, which is connected tothe first severed sensor portion, the compensation electrode being on alayer different from that for the plurality of signal lines, andoverlapped with at least one of the plurality of signal lines.

In some embodiments, the compensation electrode and the first severedsensor portion may be integrally formed.

In some embodiments, when viewed in a plan view, a side edge of thefirst severed sensor portion may have a curved shape, and thecompensation electrode may extend at the side edge of the first severedsensor portion.

In some embodiments, one of the plurality of first connecting portionswhich is used to connect adjacent ones of the first normal sensorportions may have a width smaller than that of another of the pluralityof first connecting portions which is used to connect the first severedsensor portion to a first normal sensor portion adjacent to the firstsevered sensor portion.

In some embodiments, the display device may further include a firstelectrostatic discharge pattern connected to the first severed sensorportion and overlapped with at least one of the plurality of secondelectrodes and a second electrostatic discharge pattern connected to thefirst normal sensor portion and overlapped with at least one of theplurality of second electrodes. The first electrostatic dischargepattern may have a first width, and the second electrostatic dischargepattern may have a second width smaller than the first width.

In some embodiments, the display panel includes corners, the cornershaving a rounded shape, the input-sensing unit includes corners having arounded shape corresponding to that of the corners of the display panel,and the first severed sensor portion is adjacent to the corner of theinput-sensing unit.

In some embodiments, the input-sensing unit may include a sensingregion, in which the plurality of first electrodes and the plurality ofsecond electrodes are located, and a non-sensing region, in which theplurality of first electrodes and the plurality of second electrodes arenot located. A boundary may be defined between the non-sensing regionand the sensing region, and a side edge of the first severed sensorportion may correspond to the boundary.

According to some embodiments of the inventive concept, a display devicemay include a plurality of first sensors including a normal sensorportion and a severed sensor portion and a plurality of second sensorscrossing the plurality of first sensor portions. The normal and severedsensor portions may have first and second areas, respectively, and thesecond area may be 0.05-0.45 times the first area. A capacitance betweenthe normal sensor portion and one of the second sensors adjacent theretomay be substantially the same as a capacitance between the severedsensor portion and one of the second sensors adjacent thereto.

BRIEF DESCRIPTION OF THE DRAWINGS

Example embodiments will be more clearly understood from the followingbrief description taken in conjunction with the accompanying drawings.The accompanying drawings represent non-limiting, example embodiments asdescribed herein.

FIG. 1 is a perspective view illustrating a display device according tosome embodiments of the inventive concept.

FIGS. 2A to 2F are sectional views illustrating display devicesaccording to some embodiments of the inventive concept.

FIG. 3 is a sectional view illustrating a display module according tosome embodiments of the inventive concept.

FIGS. 4A and 4B are plan views illustrating display panels according tosome embodiments of the inventive concept.

FIG. 5 is an equivalent circuit diagram illustrating a pixel accordingto some embodiments of the inventive concept.

FIG. 6 is an enlarged sectional view illustrating a display panelaccording to some embodiments of the inventive concept.

FIGS. 7A to 7D are sectional views illustrating thin-film encapsulationlayers according to some embodiments of the inventive concept.

FIG. 8 is a sectional view illustrating a display device according tosome embodiments of the inventive concept.

FIG. 9 is a plan view illustrating an input-sensing unit ISU accordingto some embodiments of the inventive concept.

FIG. 10A is a plan view illustrating a first conductive layer of aninput-sensing unit according to some embodiments of the inventiveconcept.

FIG. 10B is a plan view illustrating a second conductive layer of aninput-sensing unit according to some embodiments of the inventiveconcept.

FIG. 10C is a sectional view taken along line I-I′ of FIG. 9.

FIGS. 10D and 10E are sectional views taken along line II-II′ of FIG. 9according to embodiments of the inventive concept.

FIG. 11A is an enlarged plan view illustrating a portion ‘AA’ of FIG. 9according to some embodiments of the inventive concept.

FIG. 11B is an enlarged plan view illustrating a portion ‘BB’ of FIG. 9according to some embodiments of the inventive concept.

FIG. 12A is an enlarged plan view illustrating a portion ‘AA’ of FIG. 9according to some embodiments of the inventive concept.

FIG. 12B is an enlarged plan view illustrating a portion ‘BB’ of FIG. 9according to some embodiments of the inventive concept.

FIG. 13 is an enlarged plan view illustrating a portion ‘BB’ of FIG. 9according to some embodiments of the inventive concept.

FIG. 14 is an enlarged plan view illustrating a portion ‘BB’ of FIG. 9according to some embodiments of the inventive concept.

FIG. 15A is an enlarged plan view illustrating a portion ‘AA’ of FIG. 9according to some embodiments of the inventive concept.

FIG. 15B is an enlarged plan view illustrating a portion ‘CC’ of FIG.15A.

FIG. 15C is an enlarged plan view illustrating a portion ‘BB’ of FIG. 9according to some embodiments of the inventive concept.

FIG. 15D is an enlarged plan view illustrating a portion ‘DD’ of FIG.15C.

FIG. 16 is a plan view illustrating an input-sensing unit according tosome embodiments of the inventive concept.

FIG. 17 is a plan view illustrating an input-sensing unit according tosome embodiments of the inventive concept.

FIG. 18A is an enlarged plan view illustrating a portion ‘AA’ of FIG. 17according to some embodiments of the inventive concept.

FIG. 18B is an enlarged plan view illustrating a portion ‘BB’ of FIG. 17according to some embodiments of the inventive concept.

FIG. 19 is an enlarged plan view illustrating a portion ‘BB’ of FIG. 17according to some embodiments of the inventive concept.

FIG. 20 is an enlarged plan view illustrating a portion ‘BB’ of FIG. 17according to some embodiments of the inventive concept.

FIG. 21 is a plan view illustrating an input-sensing unit according tosome embodiments of the inventive concept.

FIG. 22A is an enlarged plan view illustrating a portion ‘AA’ of FIG. 21according to some embodiments of the inventive concept.

FIG. 22B is an enlarged plan view illustrating a portion ‘BB’ of FIG. 21according to some embodiments of the inventive concept.

FIG. 23 is an enlarged plan view illustrating a portion ‘BB’ of FIG. 21according to some embodiments of the inventive concept.

FIG. 24 is an enlarged plan view illustrating a portion ‘BB’ of FIG. 21according to some embodiments of the inventive concept.

FIG. 25 is a plan view illustrating an input-sensing unit according tosome embodiments of the inventive concept.

FIG. 26 is a sectional view taken along line III-Ill′ of FIG. 25.

FIG. 27 illustrates an input-sensing region according to someembodiments of the inventive concept.

FIG. 28 illustrates an input-sensing region and a fingerprint-sensingregion according to some embodiments of the inventive concept.

FIG. 29A is a plan view illustrating an input-sensing unit according tosome embodiments of the inventive concept.

FIG. 29B is a sectional view taken along line IV-IV′ of FIG. 29A.

FIG. 30 is a perspective view illustrating an input-sensing unitaccording to some embodiments of the inventive concept.

FIGS. 31 and 32 illustrate display devices according to some embodimentsof the inventive concept.

It should be noted that these figures are intended to illustrate thegeneral characteristics of methods, structure and/or materials utilizedin certain example embodiments and to supplement the written descriptionprovided below. These drawings are not, however, to scale and may notprecisely reflect the precise structural or performance characteristicsof any given embodiment, and should not be interpreted as defining orlimiting the range of values or properties encompassed by exampleembodiments. For example, the relative thicknesses and positioning ofmolecules, layers, regions and/or structural elements may be reduced orexaggerated for clarity. The use of similar or identical referencenumbers in the various drawings is intended to indicate the presence ofa similar or identical element or feature.

DETAILED DESCRIPTION

Example embodiments of the inventive concepts will now be described morefully with reference to the accompanying drawings, in which exampleembodiments are shown. Example embodiments of the inventive conceptsmay, however, be embodied in many different forms and should not beconstrued as being limited to the embodiments set forth herein; rather,these embodiments are provided so that this disclosure will be thoroughand complete, and will fully convey the concept of example embodimentsto those of ordinary skill in the art. In the drawings, the thicknessesof layers and regions are exaggerated for clarity. Like referencenumerals in the drawings denote like elements, and thus theirdescription will be omitted.

It will be understood that, although the terms “first”, “second”, etc.may be used herein to describe various elements, components, regions,layers and/or sections, these elements, components, regions, layersand/or sections should not be limited by these terms. These terms areonly used to distinguish one element, component, region, layer orsection from another element, component, region, layer or section. Thus,a first element, component, region, layer or section discussed belowcould be termed a second element, component, region, layer or sectionwithout departing from the teachings of example embodiments.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper” and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, if the device in thefigures is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the exemplary term “below” can encompass both anorientation of above and below. The device may be otherwise oriented(rotated 90 degrees or at other orientations) and the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of exampleembodiments. As used herein, the singular forms “a,” “an” and “the” areintended to include the plural forms as well, unless the context clearlyindicates otherwise. It will be further understood that the terms“comprises”, “comprising”, “includes” and/or “including,” if usedherein, specify the presence of stated features, integers, steps,operations, elements and/or components, but do not preclude the presenceor addition of one or more other features, integers, steps, operations,elements, components and/or groups thereof.

FIG. 1 is a perspective view illustrating a display device DD accordingto some embodiments of the inventive concept. As shown in FIG. 1, thedisplay device DD may include a display surface DD-IS, which is used todisplay an image IM. The display surface DD-IS may be defined to beparallel to a first direction axis DR1 and a second direction axis DR2.A normal direction of the display surface DD-IS (i.e., a thicknessdirection of the display device DD) will be referred to as a thirddirection axis DR3.

Hereinafter, the third direction axis DR3 may be used to differentiate afront or top surface of each element from a back or bottom surface.However, directions indicated by the first to third direction axes DR1,DR2, and DR3 may be relative concepts and may not be limited to theabove example, and, in some embodiments, they may be changed to indicateother directions. Hereinafter, first to third directions may bedirections indicated by the first to third direction axes DR1, DR2, andDR3, respectively, and will be identified with the same referencenumbers.

In FIG. 1, the display device DD is illustrated to have a flat displaysurface, but the inventive concept is not limited thereto. The displaysurface of the display device DD may have a curved or three-dimensionalshape. In the case where the display device DD has the three-dimensionaldisplay surface, the display surface may include a plurality of displayregions that are oriented in different directions. For example, thedisplay device DD may have a display surface that is shaped like apolygonal pillar.

In the present embodiment, the display device DD may be a rigid displaydevice. However, the inventive concept is not limited thereto, and insome embodiments, the display device DD may be a flexible displaydevice. In the present embodiment, the display device DD, which can beused for a cellphone terminal, is exemplarily illustrated. Although notshown, a mainboard mounted with electronic modules, a camera module, apower module, and so forth, along with the display device DD, may beprovided in a bracket or case to constitute a cellphone terminal. Thedisplay device DD may be used for large-sized electronic devices (e.g.,television sets and monitors) or small- or medium-sized electronicdevices (e.g., tablets, car navigation systems, game machines, and smartwatches).

As shown in FIG. 1, the display surface DD-IS may include a displayregion DD-DA, which is used to display the image IM, and a non-displayregion DD-NDA, which is provided to be adjacent to the display regionDD-DA. In some embodiments, the non-display area DD-NDA is not used todisplay an image. As an example of the image IM, icon images are shownin FIG. 1.

As shown in FIG. 1, the display region DD-DA may have a rectangularshape. The non-display region DD-NDA may be provided to surround thedisplay region DD-DA. However, the inventive concept is not limited tothis example, and in some embodiments, shapes of the display andnon-display regions DD-DA and DD-NDA may be variously changed in acomplementary manner.

FIGS. 2A to 2F are sectional views illustrating display devicesaccording to some embodiments of the inventive concept. FIGS. 2A to 2Fillustrate vertical sections, each of which is taken on a plane definedby the second and third directions DR2 and DR3. In FIGS. 2A to 2F, thedisplay device DD is illustrated in a simplified manner in order todescribe a stacking structure of a functional panel and/or functionalunits therein.

In some embodiments, the display device DD may include a display panel,an input-sensing unit, an anti-reflection unit, and a window unit. Atleast two of the display panel, the input-sensing unit, theanti-reflection unit, and the window unit may be successively formed bya successive process or may be combined with each other (e.g., attached)by an adhesive member. FIGS. 2A to 2F illustrate examples in which anoptically clear adhesive OCA is used as the adhesive member. In variousembodiments to be described below, the adhesive member may be anadhesive material or a gluing agent. In certain embodiments, theanti-reflection unit and the window unit may be replaced with other unitor may be omitted.

In FIGS. 2A to 2F, if a unit (e.g., the input-sensing unit, theanti-reflection unit, or the window unit) is formed on another elementby a successive process, the unit will be expressed using a term“layer”. If a unit (e.g., the input-sensing unit, the anti-reflectionunit, or the window unit) is combined with (e.g., attached to) anotherelement by an adhesive member, the unit will be expressed using a term“panel”. The unit expressed using the term “panel” may include a baselayer (e.g., a synthetic resin film, a composite film, or a glasssubstrate) providing a base surface, but the unit expressed using theterm “layer” may omit the base layer. In other words, the unit expressedusing the term “panel” may be placed on a base surface that is providedby another element or unit.

The input-sensing unit, the anti-reflection unit, and the window unitmay be referred to as an input-sensing panel ISP, an anti-reflectionpanel RPP, and a window panel WP or to as an input-sensing layer ISL, ananti-reflection layer RPL, and a window layer WL, according to whetherthe units are formed on another element by successive process or arecombined with another element by an adhesive member, and/or according tothe presence or absence of a base layer.

As shown in FIG. 2A, the display device DD may include a display panelDP, an input-sensing layer ISL, an anti-reflection panel RPP, and awindow panel WP. The input-sensing layer ISL may be directly provided onthe display panel DP. In this specification, the expression “an elementB may be directly provided on an element A” may mean that an adhesivelayer or an adhesive member is not provided between the elements A and Bor that the element B is in direct contact with the element A. After theformation of the element A, the element B may be formed on a basesurface, which is provided by the element A, through a continuousprocess.

The display panel DP and the input-sensing layer ISL, which is directlyprovided on the display panel DP, may be referred to as a display moduleDM. An optically clear adhesive OCA may be provided between the displaymodule DM and the anti-reflection panel RPP and between theanti-reflection panel RPP and the window panel WP.

The display panel DP may be configured to generate an image to bedisplayed to the outside (e.g., display an image), and the input-sensinglayer ISL may be configured to obtain coordinate information regardingan external input (e.g., a touch event). Although not shown, the displaymodule DM may further include a protection member provided on a bottomsurface of the display panel DP. The protection member and the displaypanel DP may be combined with (e.g., attached to) each other by anadhesive member. The display devices DD which will be described withreference to FIGS. 2B to 2F, may further include a protection member.

According to some embodiments of the inventive concept, the displaypanel DP may be a light-emitting type display panel, but the inventiveconcept is not limited to a specific type of the display panel DP. Forexample, the display panel DP may be an organic light emitting displaypanel or a quantum dot light-emitting display panel. A light emittinglayer of the organic light emitting display panel may be formed of orinclude an organic light emitting material. The light emitting layer ofthe quantum dot light-emitting display panel may include quantum dotsand/or quantum rods. For the sake of simplicity, the description thatfollows will refer to an example in which the display panel DP is theorganic light emitting display panel.

The anti-reflection panel RPP may be configured to reduce reflectance ofan external light that is incident on the anti-reflection panel RPP froman outer space (e.g., from outside the display device DD) to the windowpanel WP. In some embodiments, the anti-reflection panel RPP may includea phase retarder and a polarizer. The phase retarder may be of a filmtype or a liquid crystal coating type and may include a λ/2 and/or λ/4phase retarder. The polarizer may also be of a film type or a liquidcrystal coating type. The polarizer of the film type may include anelongated synthetic resin film, whereas the polarizer of the liquidcrystal coating type may include liquid crystals arranged with aspecific orientation. The phase retarder and the polarizer may furtherinclude a protection film. At least one of the phase retarder, thepolarizer, or the protection films thereof may be used as a base layerof the anti-reflection panel RPP.

In some embodiments, the anti-reflection panel RPP may include colorfilters. The color filters may be arranged in a specific manner. Thearrangement of the color filters may be determined in consideration ofcolors of lights to be emitted from pixels in the display panel DP(e.g., the arrangement of the color filters may be determined to causethe light emitted from pixels in the display panel DP to correspond toparticular colors). The anti-reflection panel RPP may further include ablack matrix that is adjacent to the color filters.

In some embodiments, the anti-reflection panel RPP may include adestructive interference structure. For example, the destructiveinterference structure may include a first reflection layer and a secondreflection layer which are provided on different layers. The firstreflection layer and the second reflection layer may be configured toallow a first reflection light reflected by the first reflection layerand a second reflection light reflected by the second reflection layerto destructively interfere with each other, which may reduce reflectanceof the external light.

In some embodiments, the window panel WP may include a base film WP-BSand a light-blocking pattern WP-BZ. The base film WP-BS may include aglass substrate and/or a synthetic resin film. In some embodiments, thebase film WP-BS may be a single-layered structure. In other embodiments,the base film WP-BS may have multiple layers. For example, in someembodiments, the base film WP-BS may include two or more films that arecombined with (e.g., attached to) each other by an adhesive film.

The light-blocking pattern WP-BZ may be partially overlapped with thebase film WP-BS. The light-blocking pattern WP-BZ may be provided on arear surface of the base film WP-BS to define a bezel region of thedisplay device DD (e.g., the non-display region DD-NDA of FIG. 1).

The light-blocking pattern WP-BZ may be a colored organic layer and maybe formed by, for example, a coating method. Although not shown, thewindow panel WP may further include a functional coating layer providedon the front surface of the base film WP-BS. The functional coatinglayer may include an anti-fingerprint layer, an anti-reflection layer, ahard coating layer, and so forth. In FIGS. 2B to 2F, the window panel WPand the window layer WL may be illustrated in a simplified manner (e.g.,without distinctly illustrating the base film WP-BS and thelight-blocking pattern WP-BZ).

As shown in FIGS. 2B and 2C, the display device DD may include a displaypanel DP, an input-sensing panel ISP, an anti-reflection panel RPP, anda window panel WP. A stacking order of the input-sensing panel ISP andthe anti-reflection panel RPP may be changed (e.g., the input-sensingpanel ISP may be above the anti-reflection panel RPP as showin in FIG.2B, or the anti-reflection panel RPP may be above the input-sensingpanel ISP as showin in FIG. 2C).

As shown in FIG. 2D, the display device DD may include a display panelDP, an input-sensing layer ISL, an anti-reflection layer RPL, and awindow layer WL. Adhesive members may be omitted from the display deviceDD, and the input-sensing layer ISL, the anti-reflection layer RPL, andthe window layer WL may be formed on a base surface, which is providedby the display panel DP, by a successive process (e.g., theinput-sensing layer ISL can be formed on the display panel DP, theanti-reflection layer RPL can be formed on the input-sensing layer ISL,and the window layer WL can be formed on the anti-reflection layer RPL).In other embodiments, a stacking order of the input-sensing layer ISLand the anti-reflection layer RPL may be changed (e.g., anti-reflectionlayer RPI can be formed on the display panel DP, input-sensing layer ISLcan be formed on the anti-reflection layer RPL, and the window layer WLcan be formed on the input-sensing layer ISL).

As shown in FIGS. 2E and 2F, in some embodiments, the display device DDdoes not include an anti-reflection unit.

As shown in FIG. 2E, the display device DD may include a display panelDP, an input-sensing layer ISL-1, and a window panel WP. Theinput-sensing layer ISL-1 according to the present embodiment may beconfigured to further have an anti-reflection function.

As shown in FIG. 2F, the display device DD may include a display panelDP-1, an input-sensing layer ISL, and a window panel WP. The displaypanel DP-1 according to the present embodiment may be configured tofurther have an anti-reflection function.

The input-sensing layer ISL-1 and the display panel DP-1 having theanti-reflection function will be described in detail below. In someembodiments, a display device may include an input-sensing panel ISPwhich may be configured to further have an anti-reflection function asdescribed with respect to the input sensing layer ISL-1, which will alsobe described in detail below.

In FIGS. 2A to 2F, the input-sensing unit is illustrated to be fullyoverlapped with the display panel. As shown in FIG. 2A, theinput-sensing unit may be fully overlapped with the display regionDD-DA.

However, in some embodiments, the input-sensing unit may be overlappedwith only a portion of the display region DD-DA or with only thenon-display region DD-NDA. The input-sensing unit may be a touch-sensingpanel, which is configured to sense a touch event from a user, or afingerprint-sensing panel, which is configured to read a fingerprint ofa user's finger. The input-sensing unit may include a plurality ofsensing electrodes (i.e. sensors), and a pitch or width of the sensingelectrodes may be changed according to an intended use of theinput-sensing unit. For the touch-sensing panel, the sensing electrodesmay have a width ranging from several millimeters to several tens ofmillimeters, whereas for the fingerprint-sensing panel, the sensingelectrodes may have a width ranging from several tens of micrometers toseveral hundreds of micrometers.

FIG. 3 is a sectional view illustrating a display panel DP according tosome embodiments of the inventive concept. FIGS. 4A and 4B are planviews illustrating display panels DP according to some embodiments ofthe inventive concept. FIG. 5 is an equivalent circuit diagramillustrating a pixel PX according to some embodiments of the inventiveconcept. FIG. 6 is an enlarged sectional view illustrating a displaypanel DP according to some embodiments of the inventive concept.Technical features of the display panel DP to be described below mayalso apply to the display devices DD described with reference to FIGS.2A to 2F.

As shown in FIG. 3, the display panel DP may include a base layer BL,and a circuit device layer DP-CL, a display device layer DP-OLED, and athin-film encapsulation layer TFE, which are provided on the base layerBL. Although not shown, the display panel DP may further includefunctional layers, such as an anti-reflection layer and a refractiveindex controlling layer.

The base layer BL may include a synthetic resin film. The syntheticresin layer may be formed on a working substrate, which is used tofabricate the display panel DP. Thereafter, a conductive layer, aninsulating layer, and so forth may be formed on the synthetic resinlayer. If the working substrate is removed, the synthetic resin layermay be used as the base layer BL. In some embodiments, the syntheticresin layer may be a polyimide-based resin layer, but the inventiveconcept is not limited to a specific material to be used for the baselayer BL. For example, in some embodiments, the base layer BL mayinclude a glass substrate, a metal substrate, and/or anorganic/inorganic composite substrate.

The circuit device layer DP-CL may include at least one insulating layerand at least one circuit device. Hereinafter, an insulating layer in thecircuit device layer DP-CL will be referred to as an intermediateinsulating layer. The intermediate insulating layer may include at leastone intermediate inorganic layer and/or at least one intermediateorganic layer. The circuit device may include signal lines, pixeldriving circuits, and so forth. The formation of the circuit devicelayer DP-CL may include forming an insulating layer, a semiconductorlayer, and a conductive layer (e.g., using a coating or depositionprocess) and then patterning the insulating layer, the semiconductorlayer, and the conductive layer (e.g., using a photolithography andetching process).

The display device layer DP-OLED may include a light-emitting device.The display device layer DP-OLED may include a plurality of organiclight emitting diodes. The display device layer DP-OLED may furtherinclude an organic layer, such as a pixel definition layer.

The thin-film encapsulation layer TFE may be provided to seal thedisplay device layer DP-OLED. The thin-film encapsulation layer TFE mayinclude at least one insulating layer. In some embodiments, thethin-film encapsulation layer TFE may include at least one inorganiclayer (hereinafter, an inorganic encapsulation layer). In someembodiments, the thin-film encapsulation layer TFE may include at leastone organic layer (hereinafter, an organic encapsulation layer) and atleast one inorganic encapsulation layer.

The inorganic encapsulation layer may be used to protect the displaydevice layer DP-OLED from moisture or oxygen, and the organicencapsulation layer may be used to protect the display device layerDP-OLED from a contamination material such as dust particles. Theinorganic encapsulation layer may include at least one of a siliconnitride layer, a silicon oxynitride layer, a silicon oxide layer, atitanium oxide layer, or an aluminum oxide layer, but the inventiveconcept is not limited thereto. The organic encapsulation layer mayinclude an acrylic organic layer, but the inventive concept is notlimited thereto.

As shown in FIG. 4A, the display panel DP may include a display regionDP-DA and a non-display region DP-NDA, when viewed in a plan view. Inthe present embodiment, the non-display region DP-NDA may be definedalong an edge or circumference of the display region DP-DA. The displayand non-display regions DP-DA and DP-NDA of the display panel DP maycorrespond to the display and non-display regions DD-DA and DD-NDA,respectively, of the display device DD shown in FIGS. 1 and 2A.

The display panel DP may include a driving circuit GDC, a plurality ofdisplay signal lines SGL, a plurality of signal pads DP-PD, and aplurality of pixels PX. The pixels PX may be placed in the displayregion DP-DA. Each of the pixels PX may include an organic lightemitting diode and a pixel driving circuit connected thereto. Thedriving circuit GDC, the display signal lines SGL, the signal padsDP-PD, and the pixel driving circuit may be included in the circuitdevice layer DP-CL shown in FIG. 3.

The driving circuit GDC may include a scan driving circuit. The scandriving circuit may be configured to generate a plurality of scansignals and sequentially output the scan signals to a plurality of scanlines GL to be described below. In addition, the scan driving circuitmay be configured to output other control signals to a driving circuitof the pixel PX.

The scan driving circuit may include a plurality of thin-filmtransistors that are formed by the same process as that for the drivingcircuit of the pixel PX (e.g., by a low temperature polycrystallinesilicon (LTPS) process or a low temperature polycrystalline oxide (LTPO)process).

The display signal lines SGL may include scan lines GL, data lines DL, apower line PL, and a control signal line CSL. Each of the scan lines GLmay be connected to corresponding ones of the pixels PX, and each of thedata lines DL may be connected to corresponding ones of the pixels PX.The power line PL may be connected to the pixels PX. The control signalline CSL may be used to provide control signals to the scan drivingcircuit.

The display signal lines SGL may be overlapped with the display andnon-display regions DP-DA and DP-NDA. Each of the display signal linesSGL may include a pad portion and a line portion. The line portion maybe overlapped with the display and non-display regions DP-DA and DP-NDA.The pad portion may be connected to an end of the line portion. The padportion may be provided on the non-display region DP-NDA and may beoverlapped with a corresponding one of the signal pads DP-PD. This willbe in more detail described below. A portion of the non-display regionDP-NDA, on which the signal pads DP-PD are provided, will be referred toas a pad region NDA-PD of the display panel DP.

The line portion, which may be substantially connected to pixels PX, mayconstitute most of each of the display signal lines SGL. The lineportion may be connected to one of transistors T1 and T2 (e.g., see FIG.5) of a pixel PX. The line portion may have a single- or multi-layeredstructure, and may be provided in the form of a single body, or mayinclude two or more portions. In the case where the line portionincludes two or more portions, the two or more portions may be providedat different layers and may be connected to each other through a contacthole, which is formed to penetrate an insulating layer therebetween.

The display panel DP may further include dummy pads IS-DPD that areprovided on the pad region NDA-PD. The dummy pads IS-DPD may be formedby the same process as that for the display signal lines SGL, and inthis case, the dummy pads IS-DPD and the display signal lines SGL may beformed on the same layer or at the same level. The dummy pads IS-DPD maybe selectively provided in a display device DD including theinput-sensing layer ISL or ISL-1 shown in FIGS. 2A and 2D to 2F, and thedummy pads IS-DPD may be omitted from a display device DD including aninput-sensing panel ISP shown in FIGS. 2B and 2C.

The dummy pads IS-DPD may be overlapped with pad portions of signallines, which may be provided in the input-sensing layer ISL or ISL-1shown in FIGS. 2A and 2D to 2F. The dummy pads IS-DPD may be floatingelectrodes. For example, the dummy pads IS-DPD may be electricallydisconnected from the display signal lines SGL of the display panel.

As shown in FIG. 4A, a circuit board PCB may be electrically connectedto the display panel DP. The circuit board PCB may be a rigid orflexible circuit board. The circuit board PCB may be directly bonded tothe display panel DP or may be connected to the display panel DP throughanother circuit board.

A timing control circuit TC for controlling operations of the displaypanel DP may be provided on the circuit board PCB. In addition, aninput-sensing circuit IS-C for controlling the input-sensing unit ISU(e.g., the input-sensing panel ISP or the input-sensing layer ISL) maybe provided on the circuit board PCB. Each of the timing control circuitTC and the input-sensing circuit IS-C may be provided in the form of anintegrated circuit chip and may be mounted on the circuit board PCB. Insome embodiments, the timing control circuit TC and the input-sensingcircuit IS-C may be integrated in a single chip and may be mounted onthe circuit board PCB. The circuit board PCB may include circuit boardpads PCB-P that are electrically connected to the display panel DP.Although not shown, the circuit board PCB may further include signallines, which are provided to connect the circuit board pads PCB-P to thetiming control circuit TC and/or the input-sensing circuit IS-C.

As shown in FIG. 4B, the display panel DP may further include achip-mounting region NDA-TC placed on the non-display region DP-NDA. Atiming control circuit TC (e.g., see FIG. 4A), which is provided in theform of a chip and is called ‘a control circuit chip’, may be mounted onthe chip-mounting region NDA-TC.

First chip pads TC-PD1 and second chip pads TC-PD2 may be provided inthe chip-mounting region NDA-TC. The first chip pads TC-PD1 may beconnected to the data lines DL, and the second chip pads TC-PD2 may beconnected to the signal pads DP (e.g., through the signal lines).Terminals of the control circuit chip TC may be connected to the firstchip pads TC-PD1 and the second chip pads TC-PD2. As a result, the datalines DL may be electrically connected to the signal pads DP through thecontrol circuit chip.

In some embodiments, at least one of the control signal line CSL and thepower line PL may also be connected to the control circuit chip TC.

FIG. 5 illustrates an example, in which one scan line GL, one data lineDL, one power line PL, and one pixel PX connected thereto are provided.However, the structure of the pixel PX is not limited to that shown inFIG. 5, and in some embodiments, it may be variously changed.

The organic light emitting diode OLED may be a top-emission type diodeor a bottom-emission type diode. The pixel PX may include a first orswitching transistor T1, a second or driving transistor T2, and acapacitor Cst, which may be used as a pixel driving circuit for drivingthe organic light emitting diode OLED. A first power voltage ELVDD maybe provided to the second transistor T2, and a second power voltageELVSS may be provided to the organic light emitting diode OLED. Thesecond power voltage ELVSS may be lower than the first power voltageELVDD.

If a scan signal is applied to the scan line GL, the first transistor T1may output a data signal applied to the data line DL in response to thescan signal. The capacitor Cst may be charged to have a voltagecorresponding to the data signal, which is transmitted from the firsttransistor T1. The second transistor T2 may be connected to the organiclight emitting diode OLED. The second transistor T2 may control adriving current flowing through the organic light emitting diode OLED,based on an amount of charge stored in the capacitor Cst (e.g., thevoltage across the capacitor Cst).

The equivalent circuit in FIG. 5 is just one of possible embodiment of acircuit of the pixel, but the inventive concept is not limited thereto.The pixel PX may be configured to include at least one transistor or atleast one capacitor. In certain embodiments, the organic light emittingdiode OLED may be coupled to the power line PL and the second transistorT2.

The vertical section of FIG. 6 illustrates a portion of the displaypanel DP corresponding to the equivalent circuit diagram of FIG. 5.

The circuit device layer DP-CL, the display device layer DP-OLED, andthe thin-film encapsulation layer TFE may be sequentially placed on thebase layer BL. In0 the present embodiment, the circuit device layerDP-CL may include a buffer layer BFL made of an inorganic material, afirst intermediate inorganic layer 10, a second intermediate inorganiclayer 20, and an intermediate organic layer 30 made of an organicmaterial. The inorganic and organic layers may not be limited tospecific materials, and in some embodiments, the buffer layer BFL may beoptionally provided or omitted.

The first transistor T1 and the second transistor T2 may include asemiconductor pattern OSP1 and a semiconductor pattern OSP2(hereinafter, a first semiconductor pattern and a second semiconductorpattern), respectively, which are provided on the buffer layer BFL. Thefirst semiconductor pattern OSP1 and the second semiconductor patternOSP2 may be formed of or include at least one of amorphous silicon, polysilicon, or metal oxide semiconductor materials.

The first intermediate inorganic layer 10 may be provided on the firstsemiconductor pattern OSP1 and the second semiconductor pattern OSP2.The first transistor T1 and the second transistor T2 may include acontrol electrode GE1 and a control electrode GE2 (hereinafter, a firstcontrol electrode and a second control electrode), respectively, whichare provided on the first intermediate inorganic layer 10. The firstcontrol electrode GE1 and the second control electrode GE2 may be formedusing the same photolithography process as that for forming the scanlines GL of FIG. 5A.

The second intermediate inorganic layer 20 may be provided on the firstintermediate inorganic layer 10 covering the first control electrode GE1and the second control electrode GE2. The first transistor T1 mayinclude an input electrode DE1 and an output electrode SE1 (hereinafter,a first input electrode and a first output electrode) provided on thesecond intermediate inorganic layer 20, and the second transistor T2 mayinclude an input electrode DE2 and an output electrode SE2 (hereinafter,a second input electrode and a second output electrode) provided on thesecond intermediate inorganic layer 20.

A first through hole CH1 and a second through hole CH2 may be formed topenetrate both of the first and second intermediate inorganic layers 10and 20, and the first input electrode DE1 and the first output electrodeSE1 may be connected to two different portions of the firstsemiconductor pattern OSP1 through the first and second through holesCH1 and CH2, respectively. A third through hole CH3 and a fourth throughhole CH4 may be formed to penetrate both of the first and secondintermediate inorganic layers 10 and 20, and the second input electrodeDE2 and the second output electrode SE2 may be connected to twodifferent portions of the second semiconductor pattern OSP2 through thethird and fourth through holes CH3 and CH4, respectively. In someembodiments, at least one of the first transistor T1 and the secondtransistor T2 may be modified to have a bottom gate structure.

-   The intermediate organic layer 30 may be provided on the second    intermediate inorganic layer 20 to cover the first input electrode    DE1, the second input electrode DE2, the first output electrode SE1,    and the second output electrode SE2. The intermediate organic layer    30 may be provided to have a flat surface.

The display device layer DP-OLED may be provided on the intermediateorganic layer 30. The display device layer DP-OLED may include a pixeldefinition layer PDL and an organic light emitting diode OLED. The pixeldefinition layer PDL may be formed of or include an organic material. Afirst electrode AE may be provided on the intermediate organic layer 30.The first electrode AE may be connected to the second output electrodeSE2 through a fifth through hole CH5 penetrating the intermediateorganic layer 30. An opening OP may be defined in the pixel definitionlayer PDL. The opening OP of the pixel definition layer PDL may beprovided to expose at least a portion of the first electrode AE. In someembodiments, the pixel definition layer PDL may be omitted.

The pixel PX may be placed in the display region DP-DA. The displayregion DP-DA may include a light-emitting region PXA and anon-light-emitting region NPXA adjacent to the light-emitting regionPXA. The non-light-emitting region NPXA may be provided to surround thelight-emitting region PXA. In the present embodiment, the light-emittingregion PXA may be defined to correspond to a region of the firstelectrode AE exposed by the opening OP.

In some embodiments, the light-emitting region PXA may be overlappedwith at least one of the first and second transistors T1 and T2. Theopening OP may be enlarged, and the first electrode AE and/or a lightemitting layer EML to be described below may also be enlarged.

A hole control layer HCL may be provided in common on the light-emittingregion PXA and the non-light-emitting region NPXA. Although not shown, acommon layer, such as the hole control layer HCL, may be provided incommon in a plurality of the pixels PX (e.g., see FIG. 4A).

The light emitting layer EML may be provided on the hole control layerHCL. The light emitting layer EML may be provided on a regioncorresponding to the opening OP. In other words, the light emittinglayer EML may have an isolated structure that is provided for each ofthe pixels PX. The light emitting layer EML may include an organicmaterial and/or an inorganic material. The light emitting layer EML maybe configured to generate a specific color light.

In the present embodiment, the light emitting layer EML is illustratedto have a patterned structure, but in some embodiments the lightemitting layer EML may be provided in common on a plurality of thepixels PX. Here, the light emitting layer EML may be configured togenerate a white-color light. Also, the light emitting layer EML mayhave a multi-layered structure called ‘tandem’.

An electron control layer ECL0 may be provided on the light emittinglayer EML. Although not shown, the electron control layer ECL may beprovided in common in the plurality of pixels PX (e.g., see FIG. 4A). Asecond electrode CE may be provided on the electron control layer ECL.The second electrode CE may be provided in common on a plurality of thepixels PX.

The thin-film encapsulation layer TFE may be provided on the secondelectrode CE. The thin-film encapsulation layer TFE may be provided incommon on a plurality of the pixels PX. In the present embodiment, thethin-film encapsulation layer TFE may be provided to directly cover thesecond electrode CE. In some embodiments, a capping layer may be furtherprovided between the thin-film encapsulation layer TFE and the secondelectrode CE, thereby covering the second electrode CE. Here, thethin-film encapsulation layer TFE may be provided to directly cover thecapping layer.

In some embodiments, the organic light emitting diode OLED may furtherinclude a resonance structure, which is used to control a resonancedistance of light emitted from the light emitting layer EML. Theresonance structure may be provided between the first electrode AE andthe second electrode CE, and a thickness of the resonance structure maybe determined depending on a wavelength of light to be emitted from thelight emitting layer EML.

FIGS. 7A to 7D are sectional views illustrating thin-film encapsulationlayers TFE according to some embodiments of the inventive concept. Thethin-film encapsulation layers TFE of FIGS. 7A to 7D may be configuredto have substantially the same technical features as those of thethin-film encapsulation layer TFE described with reference to FIG. 3.

As shown in FIG. 7A, the thin-film encapsulation layer TFE may include ninorganic encapsulation layers IOL1 to IOLn, where n is a natural numberlarger than 2. Here, the first one (i.e., IOL1) of the inorganicencapsulation layers may be in contact with the second electrode CE(e.g., see FIG. 6).

The thin-film encapsulation layer TFE may further include (n−1) organicencapsulation layers OL1, and in some embodiments, the (n−1) organicencapsulation layers OL1 and the n inorganic encapsulation layers IOL1to IOLn may be alternately provided. Each of the (n−1) organicencapsulation layers OL1 may have a thickness that is larger than a meanthickness of the n inorganic encapsulation layers IOL1 to IOLn.

Each of the n inorganic encapsulation layers IOL1 to may be a singlelayer made of a single material or may be a multi-layered structure, inwhich at least two layers made of different materials are included. The(n−1) organic encapsulation layers OL1 may be formed by a process ofdepositing organic monomers. The organic monomers may include, forexample, at least one of acryl-based monomers, but the inventive conceptis not limited thereto.

In some embodiments, the thin-film encapsulation layer TFE may include asilicon oxynitride layer, an organic monomer layer, and a siliconnitride layer, which are sequentially stacked on the second electrodeCE. In certain embodiments, another inorganic layer may be provided onthe silicon nitride layer, and the silicon nitride layer may be a doublelayered structure (e.g., including two layers, which are formed bydeposition processes under different conditions).

As shown in FIG. 7B, the thin-film encapsulation layer TFE may include afirst inorganic encapsulation layer IOL1, a first organic encapsulationlayer OL1, a second inorganic encapsulation layer IOL2, a second organicencapsulation layer OL2, and a third inorganic encapsulation layer IOL3,which are sequentially stacked.

The first inorganic encapsulation layer IOL1 may have a double-layeredstructure. A first sub-layer S1 may be a lithium fluoride layer, and asecond sub-layer S2 may be an aluminum oxide layer. The first organicencapsulation layer OL1 may be a first organic monomer layer, the secondinorganic encapsulation layer IOL2 may be a first silicon nitride layer,the second organic encapsulation layer OL2 may be a second organicmonomer layer, and the third inorganic encapsulation layer IOL3 may be asecond silicon nitride layer.

As shown in FIG. 7C, the thin-film encapsulation layer TFE may include afirst inorganic encapsulation layer IOL10, the first organicencapsulation layer OL1, and a second inorganic encapsulation layerIOL20, which are sequentially stacked. Each of the first and secondinorganic encapsulation layers IOL10 and IOL20 may have a double-layeredstructure. A first sub-layer S10 may be a lithium fluoride layer, and asecond sub-layer S20 may be a silicon oxide layer. The second inorganicencapsulation layer IOL20 may include a first sub-layer S100 and asecond sub-layer S200, which are deposited under different depositionenvironments. The first sub-layer S100 may be deposited under a lowpower condition, and the second sub-layer S200 may be deposited under ahigh power condition. Each of the first sub-layer S100 and the secondsub-layer S200 may be a silicon nitride layer.

As shown in FIG. 7D, the thin-film encapsulation layer TFE may include aplurality of inorganic encapsulation layers, which are sequentiallystacked. The thin-film encapsulation layer TFE may include a firstinorganic encapsulation layer IOL1, a second inorganic encapsulationlayer IOL2, and a third inorganic encapsulation layer IOL3. At least oneof the inorganic encapsulation layers may be or include a siliconnitride layer, a silicon oxynitride layer, a silicon oxide layer, atitanium oxide layer, or an aluminum oxide layer. For example, at leastone of the first and third inorganic encapsulation layers IOL1 and IOL3may include a silicon nitride layer, a silicon oxynitride layer, asilicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

At least one of the inorganic encapsulation layers may be or may includea hexamethyldisiloxane (HMDSO) layer. The HMDSO layer may have astress-absorption property. The second inorganic encapsulation layerIOL2 may be the HMDSO layer. The second inorganic encapsulation layerIOL2 may be used to absorb stress of the first and third inorganicencapsulation layers IOL1 and IOL3. Accordingly, the thin-filmencapsulation layer TFE may become more flexible.

In the case where the thin-film encapsulation layer TFE has only theinorganic encapsulation layers, it may be possible to form the thin-filmencapsulation layer TFE within a single chamber through a successivedeposition process, and thus to simplify a process of forming thethin-film encapsulation layer TFE. In the case where the thin-filmencapsulation layer TFE has at least one organic encapsulation layer andat least one inorganic encapsulation layer, it is necessary to change aprocess chamber at least one time. In the case where one of theinorganic encapsulation layers is an HMDSO layer, the thin-filmencapsulation layer TFE may have increased flexibility.

FIG. 8 is a sectional view illustrating a display device DD according tosome embodiments of the inventive concept. FIG. 9 is a plan viewillustrating an input-sensing unit ISU according to some embodiments ofthe inventive concept. FIG. 10A is a plan view illustrating a firstconductive layer IS-CL1 of the input-sensing unit ISU according to someembodiments of the inventive concept. FIG. 10B is a plan viewillustrating a second conductive layer IS-CL2 of the input-sensing unitISU according to some embodiments of the inventive concept. FIG. 10C isa sectional view taken along line I-I′ of FIG. 9. FIGS. 10D and 10E aresectional views taken along line II-II′ of FIG. 9.

In FIG. 8, the display panel DP is illustrated in a simplified manner todescribe a stacking structure of the input-sensing unit ISU. Forexample, the anti-reflection unit and the window unit may be provided onthe input-sensing unit ISU but they are not shown in FIG. 8.

In the present embodiment, the input-sensing unit ISU, which is of the“layer” shape described with reference to FIG. 2A, will be exemplarilydescribed. Since the input-sensing unit ISU of the “layer” shape isdirectly provided on a base surface provided by the display panel DP, itmay be possible to omit a base layer, and thus, it may be possible toreduce a thickness of the display module DM. In the present embodiment,the base surface may be a top surface of the thin-film encapsulationlayer TFE.

The input-sensing unit ISU may have a multi-layered structure,regardless of its shape. For example, the input-sensing unit ISU mayinclude a sensing electrode, a signal line connected to the sensingelectrode, and at least one insulating layer. The input-sensing unit ISUmay be configured to sense an external input, for example, in ancapacitance sensing manner. The inventive concept is not limited to aspecific sensing method of the input-sensing unit ISU, and in someembodiments, the input-sensing unit ISU may be configured to sense anexternal input in an electromagnetic induction manner or apressure-sensing manner.

As shown in FIG. 8, the input-sensing unit ISU may include the firstconductive layer IS-CL1, a first insulating layer IS-IL1, the secondconductive layer IS-CL2, and a second insulating layer IS-IL2. Each ofthe first and second conductive layers IS-CL1 and IS-CL2 may have asingle-layered structure or may have a multi-layered structure includinga plurality of layers stacked in the third direction DR3. The conductivelayer of the single-layered structure may be formed of or include ametal layer or a transparent conductive layer. The metal layer mayinclude at least one of molybdenum, silver, titanium, copper, aluminum,or alloys thereof. The transparent conductive layer may includetransparent conductive oxide, such as indium tin oxide (ITO), indiumzinc oxide (IZO), zinc oxide (ZnO), or indium tin zinc oxide (ITZO). Insome embodiments, the transparent conductive layer may include aconductive polymer (e.g., PEDOT), metal nanowires, or graphene.

In an embodiment where the conductive layer has the multi-layeredstructure, it may include a stack of metal layers. The stack of themetal layers may be a triple-layered structure oftitanium/aluminum/titanium. The conductive layer of the multi-layeredstructure may include at least one metal layer and at least onetransparent conductive layer.

Each of the first and second conductive layers IS-CL1 and IS-CL2 mayinclude a plurality of patterns. The description that follows will referto an example in which the first conductive layer IS-CL1 includes firstconductive patterns and the second conductive layer IS-CL2 includessecond conductive patterns. Each of the first and second conductivepatterns may include at least one sensing electrode and at least onesignal line.

A stacking structure and a material of the sensing electrode may bedetermined in consideration of technical requirements on sensingsensitivity. The sensing sensitivity may be affected by aresistive-capacitive (RC) delay, and a metal layer may have electricresistance lower than that of a transparent conductive layer. Thus, thesensing electrodes formed of the metal layer may have a reduced RC delayvalue, and a charging time taken to charge a capacitor defined betweenthe sensing electrodes may be reduced. In embodiments where the sensingelectrodes are formed of the transparent conductive layer, they may notbe easily recognized by a user, compared with the sensing electrodesformed of the metal layer, and thus, it may be possible to increase aninput area and an effective capacitance.

To prevent the sensing electrodes in the metal layer from beingrecognized by a user, the sensing electrodes may be provided in a meshshape. A thickness of the thin-film encapsulation layer TFE may beadjusted (e.g., configured or designed) to prevent the input-sensingunit ISU from being affected by noise caused by elements of the displaydevice layer DP-OLED. Each of the first and second insulating layersIS-IL1 and IS-IL2 may have a single- or multi-layered structure. Each ofthe first and second insulating layers IS-IL1 and IS-IL2 may include aninorganic material, an organic matter, or a composite material.

At least one of the first and second insulating layers IS-IL1 and IS-IL2may include an inorganic layer. The inorganic layer may include at leastone of aluminum oxide, titanium oxide, silicon oxide, siliconoxynitride, zirconium oxide, or hafnium oxide.

At least one of the first and second insulating layers IS-IL1 and IS-IL2may include an organic layer. The organic layer may include at least oneof acrylic resins, methacryl resins, polyisoprene resins, vinyl resins,epoxy resins, urethane resins, cellulose resins, siloxane resins,polyimide resins, polyamide resins, or perylene resins.

As shown in FIG. 9, the input-sensing unit ISU may include first sensingelectrodes 1E1-1 to 1E1-5, first signal lines SL1-1 to SL1-5 connectedto the first sensing electrodes 1E1-1 to 1E1-5, second sensingelectrodes 1E2-1 to 1E2-4, and second signal lines SL2-1 to SL2-4connected to the second sensing electrodes 1E2-1 to 1E2-4. Although notshown, the input-sensing unit ISU may further include an optical dummyelectrode provided in a boundary region between the first and secondsensing electrodes 1E1-1 to 1E1-5 and 1E2-1 to 1E2-4.

The thin-film encapsulation layer TFE shown in FIG. 8 may include atleast one inorganic encapsulation layer, and thus, it may provide a basesurface having an improved flatness. Accordingly, the failure rate offorming the elements of the input-sensing unit ISU may be reduced evenwhen the elements of the input-sensing unit ISU are successively formed.The first signal lines SL1-1 to SL1-5 and the second signal lines SL2-1to SL2-4 may be provided on the non-display region DD-NDA having areduced height difference, and thus, each of them may be formed to havea uniform thickness. It may be possible to reduce a stress exerted on aregion, at which height differences of the first signal lines SL1-1 toSL1-5 and the second signal lines SL2-1 to SL2-4 are superposed.

Referring to FIG. 9, the input-sensing unit ISU may include aninput-sensing region ISA and a non-input-sensing region NISA. The firstand second sensing electrodes 1E1-1 to 1E1-5 and 1E2-1 to 1E2-4 forsensing an external input may be provided on the input-sensing regionISA.

The first sensing electrodes 1E1-1 to 1E1-5 may be provided to cross thesecond sensing electrodes 1E2-1 to 1E2-4. The first sensing electrodes1E1-1 to 1E1-5 may be arranged in the first direction DR1 and each ofthem may extend in the second direction DR2. The first and secondsensing electrodes 1E1-1 to 1E1-5 and 1E2-1 to 1E2-4 may be configuredto sense an external input in a mutual-capacitance manner and/or aself-capacitance manner. In some embodiments, during a first period,coordinates of an external input may be obtained in themutual-capacitance manner, and during a second period, coordinates ofthe external input may be obtained in the self-capacitance manner.

Each of the first sensing electrodes 1E1-1 to 1E1-5 may include firstsensor portions SP1 and first connecting portions CP1. Each of thesecond sensing electrodes 1E2-1 to 1E2-4 may include second sensorportions SP2 and second connecting portions CP2.

In some embodiments, the input-sensing region ISA does not have arectangular shape. In FIG. 9, the input-sensing region ISA isillustrated to have a rectangular shape, from which a central topportion is removed, but the inventive concept is not limited thereto.For example, the shape of the input-sensing region ISA may be variouslychanged, as required. However, in the case where the shape of theinput-sensing region ISA is changed, some of the first sensor portionsSP1 or some of the second sensor portions SP2 may not have the minimumarea required to sense an external input.

In some embodiments, two ones of the first sensor portions SP1, whichare located at opposite ends of the first sensing electrode (or adjacentthe edge of the input-sensing region ISA), may have a small area or size(e.g., half area), compared with a central one (e.g., not adjacent theedge of the input-sensing region ISA) of the first sensor portions SP1.Also, at least one of the first sensor portions SP1 may have an areathat is smaller than half that of a central one of the first sensorportions SP1. In FIG. 9, the first sensor portions SP1 located at bothends of the first sensing electrode 1E1-1 (at the uppermost region ofthe input-sensing unit ISU) are illustrated to have an area smaller thanhalf that of the central one of the first sensor portions SP1.

Two ones of the second sensor portions SP2, which are located atopposite ends of the second sensing electrode (or adjacent the edge ofthe input-sensing region ISA), may have a small area or size (e.g., halfarea), compared with a central one (e.g., not adjacent the edge of theinput-sensing region) of the second sensor portions SP2. Also, at leastone of the second sensor portions SP2 may have an area that is smallerthan half that of a central one of the second sensor portions SP2. InFIG. 9, the second sensor portions SP2, which are located at one-sideends (e.g., one end) of the second sensing electrodes 1E2-1 and 1E2-4(at left and right sides of the input-sensing unit ISU), are illustratedas having an area smaller than half that of a central one of the secondsensor portions SP2.

FIG. 9 illustrates the first sensing electrodes 1E1-1 to 1E1-5 and thesecond sensing electrodes 1E2-1 to 1E2-4, according to some embodimentsof the inventive concept, but the inventive concept is not limited tospecific shapes thereof. In some embodiments, the first sensingelectrodes 1E1-1 to 1E1-5 and the second sensing electrodes 1E2-1 to1E2-4 may have a shape (e.g., a bar shape), in which the sensor portionand the connecting portion are not differentiated from each other. Thefirst sensor portions SP1 and the second sensor portions SP2 areillustrated to have a diamond-like shape, but the inventive concept isnot limited thereto. For example, each of the first and/or second sensorportions SP1 and SP2 may be provided to have other polygonal shapes.Furthermore, in some embodiments, at least one of the first and secondsensor portions SP1 and SP2 may include a portion with a curved shape.

In one or each of the first sensing electrodes 1E1-1 to 1E1-5, the firstsensor portions SP1 may be arranged in the second direction DR2, and inone or each of the second sensing electrodes 1E2-1 to 1E2-4, the secondsensor portions SP2 may be arranged in the first direction DR1. Each ofthe first connecting portions CP1 may be provided to connect adjacentones of the first sensor portions SP1 to each other (e.g., to connectadjacent ones of the first sensor portions SP1 in the same first sensingelectrode), and each of the second connecting portions CP2 may beprovided to connect adjacent ones of the second sensor portions SP2 toeach other (e.g., to connect adjacent ones of the second sensor portionsSP2 in the same second sensing electrode). In some embodiments, in atleast one of the first sensing electrodes 1E1-1 to 1E1-5, at least oneof the first sensor portions SP1 is not connected to an adjacent one ofthe first sensor portions SP1 in the same first sensing electrode,and/or in at least one of the second sensing electrodes, at least one ofthe second sensor portions SP2 is not connected to an adjacent one ofthe second sensor portions SP2 in the same second sensing electrode.

The first signal lines SL1-1 to SL1-5 may be connected to one-side ends(e.g., one end) of the first sensing electrodes 1E1-1 to 1E1-5,respectively. The second signal lines SL2-1 to SL2-4 may be connected toboth ends of the second sensing electrodes 1E2-1 to 1E2-4. In someembodiments, the first signal lines SL1-1 to SL1-5 may be connected toboth ends of the first sensing electrodes 1E1-1 to 1E1-5. In someembodiments, the second signal lines SL2-1 to SL2-4 may be connected toonly one-side ends (e.g., one end) of the second sensing electrodes1E2-1 to 1E2-4, respectively.

According to some embodiments of the inventive concept, it may bepossible to improve the sensing sensitivity of an input-sensing unitISU, compared with an input-sensing unit ISU in which the second signallines SL2-1 to SL2-4 are connected to one-side ends (e.g., one end) ofthe second sensing electrodes 1E2-1 to 1E2-4, respectively. In someembodiments, since the second signal lines SL2-1 to SL2-4 which areconnected to both ends of the second sensing electrodes 1E2-1 to 1E2-4are used to transmit detection or transmission signals, it may bepossible to prevent voltage drop of the detection or transmissionsignals and to prevent deterioration of the sensing sensitivity.

Each of the first and second signal lines SL1-1 to SL1-5 and SL2-1 toSL2-4 may include a line portion SL-L and a pad portion SL-P. The padportions SL-P may be provided on the pad region NDA-PD of theinput-sensing unit ISU and may be aligned with each other. The padportions SL-P may be overlapped with the dummy pads IS-DPD shown in FIG.4A.

The input-sensing unit ISU may include the signal pads DP-PD. The signalpads DP-PD may be provided on the pad region NDA-PD and may be alignedwith each other.

In some embodiments, the first signal lines SL1-1 to SL1-5 and thesecond signal lines SL2-1 to SL2-4 may be replaced with a circuit boardor the like, which is separately fabricated and is combined with thedisplay panel DP.

In some embodiments, although not shown, the pad portion SL-P of thefirst signal lines SL1-1 to SL1-5 and the pad portion SL-P of the secondsignal lines SL2-1 to SL2-4 may be provided at different regions, andthe signal pads DP-PD may be interposed between them. Since the twogroups of the pad portions SL-P may be spaced apart from each other, itmay be possible to easily connect the circuit board to them and tosimplify the structure of the circuit board.

In some embodiments, positions of the first signal lines SL1-1 to SL1-5may be exchanged with positions of the second signal lines SL2-1 toSL2-4. The first signal lines SL1-1 to SL1-5 may be provided at a leftside, and the second signal lines SL2-1 to SL2-4 may be provided at aright side, or vice versa.

As shown in FIG. 10A, the first conductive layer IS-CL1 may include thefirst connecting portions CP1. In addition, the first conductive layerIS-CL1 may include first line portions SL1-11 to SL1-51 of the firstsignal lines SL1-1 to SL1-5 and first line portions SL2-11 to SL2-41 ofthe second signal lines SL2-1 to SL2-4.

In some embodiments, the first connecting portions CP1, the first lineportions SL1-11 to SL1-51 of the first signal lines SL1-1 to SL1-5, andthe first line portions SL2-11 to SL2-41 of the second signal linesSL2-1 to SL2-4 may be formed by the same process. The first connectingportions CP1, the first line portions SL1-11 to SL1-51 of the firstsignal lines SL1-1 to SL1-5, and the first line portions SL2-11 toSL2-41 of the second signal lines SL2-1 to SL2-4 may include the samematerial and may have the same stacking structure. In some embodiments,the first connecting portions CP1 may be formed by a process that isdifferent from that for forming the first line portions SL1-11 to SL1-51of the first signal lines SL1-1 to SL1-5 and the first line portionsSL2-11 to SL2-41 of the second signal lines SL2-1 to SL2-4. Accordingly,the first line portions SL1-11 to SL1-51 of the first signal lines SL1-1to SL1-5 and the first line portions SL2-11 to SL2-41 of the secondsignal lines SL2-1 to SL2-4 may have the same stacking structure, butthe first connecting portions CP1 may have a stacking structuredifferent from that of the first line portions SL1-11 to SL1-51 andSL2-11 to SL2-41.

In some embodiments, the first conductive layer IS-CL1 may include thesecond connecting portions CP2 (e.g., see FIG. 9). Here, the firstconnecting portions CP1 may be formed from the first conductive layerIS-CL1. Accordingly, each of the first sensing electrodes 1E1-1 to 1E1-5may have a single body shape.

Although not shown in FIG. 10A, the first insulating layer IS-IL1 may beprovided to cover at least the first connecting portions CP1. In thepresent embodiment, the first insulating layer IS-IL1 may be overlappedwith at least a portion of the display and non-display regions DD-DA andDD-NDA. The first insulating layer IS-IL1 may be provided to cover thefirst line portions SL1-11 to SL1-51 of the first signal lines SL1-1 toSL1-5 and the first line portions SL2-11 to SL2-41 of the second signallines SL2-1 to SL2-4.

In the present embodiment, the first insulating layer IS-IL1 may beoverlapped with the display region DD-DA and the pad region NDA-PD. Thefirst insulating layer IS-IL1 may be fully overlapped with the displayregion DD-DA and the non-display region DD-NDA.

First connection contact holes CNT-I and second connection contact holesCNT-S may be defined in the first insulating layer IS-IL1. The firstconnection contact holes CNT-I may be provided to partially expose thefirst connecting portions CP1, and the second connection contact holesCNT-S may be provided to partially expose the first line portions SL1-11to SL1-51 of the first signal lines SL1-1 to SL1-5 and the first lineportions SL2-11 to SL2-41 of the second signal lines SL2-1 to SL2-4.

As shown in FIG. 10B, the second conductive layer IS-CL2 may include thefirst sensor portions SP1, the second sensor portions SP2, and thesecond connecting portions CP2. Each of the second sensing electrodes1E2-1 to 1E2-4 may have a single-body shape (e.g., may be integrallyformed). The first sensor portions SP1 may be spaced apart from thesecond sensing electrodes 1E2-1 to 1E2-4.

The second conductive layer IS-CL2 may include second line portionsSL1-12 to SL1-52 of the first signal lines SL1-1 to SL1-5, pad portionsSL-P of the first signal lines SL1-1 to SL1-5, second line portionsSL2-12 to SL2-42 of the second signal lines SL2-1 to SL2-4, and padportions SL-P of the second signal lines SL2-1 to SL2-4. In addition,the second conductive layer IS-CL2 may include the signal pads DP-PD.

The first sensor portions SP1, the second sensor portions SP2, and thesecond connecting portions CP2 may be formed by the same process. Thefirst sensor portions SP1, the second sensor portions SP2, and thesecond connecting portions CP2 may include the same material and mayhave the same stacking structure. The second line portions SL1-12 toSL1-52 of the first signal lines SL1-1 to SL1-5, the pad portions SL-Pof the first signal lines SL1-1 to SL1-5, the second line portionsSL2-12 to SL2-42 of the second signal lines SL2-1 to SL2-4, the padportions SL-P of the second signal lines SL2-1 to SL2-4, and the signalpads DP-PD may be formed by a process that is the same as or differentfrom that for forming the first sensor portions SP1, the second sensorportions SP2, and the second connecting portions CP2.

Although not shown in FIG. 10B, the second insulating layer IS-IL2 maybe overlapped with at least a portion of the display and non-displayregions DD-DA and DD-NDA. In the present embodiment, the secondinsulating layer IS-IL2 may be provided to expose the pad region NDA-PD.

As shown in FIG. 10C, the first sensor portions SP1 may be electricallyconnected to respective first connecting portions CP1 through the firstconnection contact holes CNT-I. The first connecting portion CP1 may beformed of or include a material whose electric resistance is lower thanthat of the first sensor portions SP1.

The first connecting portion CP1 may be provided to cross the secondconnecting portion CP2 with respect to the plane in the first and seconddirections DR1 and DR2, and here, in order to suppress the effect ofparasitic capacitance, the first connecting portion CP1 may beconfigured to have a reduced a width or planar area. In order to improvethe sensing sensitivity, the first connecting portion CP1 may include alow resistive material (e.g., the same metal material as the first lineportions SL1-11 to SL1-51 of the first signal lines SL1-1 to SL1-5).

In the present embodiment, the first insulating layer IS-IL1 may be apolymer layer (e.g., an acryl polymer layer). The second insulatinglayer IS-IL2 may also be a polymer layer (e.g., an acryl polymer layer).Even when the input-sensing unit ISU is directly provided on the displaypanel DP as shown in FIGS. 8 and 10D, the polymer layer may improveflexibility of the display device DD. To improve the flexibility, thefirst sensor portions SP1 and the second sensor portions SP2 may have amesh shape and may include a metallic material. The first and secondsensor portions SP1 and SP2 may be referred to as ‘a metal meshpattern’.

Three ones (e.g., SL1-1 to SL1-3) of the first signal lines SL1-1 toSL1-5 are exemplarily illustrated in FIG. 10D. Referring to the firstsignal line SL1-1, the first line portion SL1-11 and the second lineportion SL1-12 may be electrically connected to each other through thesecond connection contact holes CNT-S. This may reduce the electricalresistance of the first signal line SL1-1. The first line portionsSL2-11 to SL2-41 and the second line portions SL2-12 to SL2-42 of thesecond signal lines SL2-1 to SL2-4 may similarly be electricallyconnected to each other through the second contact holes CNT-S.

In some embodiments, one of the first line portion (e.g., SL1-11) andthe second line portion (e.g., SL1-12) for one or more of the firstsignal lines SL1-1 to SL1-5 may be omitted. In some embodiments, one ofthe first and second line portions of the second signal lines SL2-1 toSL2-4 may be omitted.

As shown in FIG. 10E, in some embodiments, the first line portion SL1-11may be omitted. The first signal line SL1-1 may be substantially thesame as the structure of FIG. 10D having only the second line portionSL1-12. The first signal line SL1-1 may include a metal layer SL1-12Mand a transparent conductive layer SL1-12T, which is directly providedon the metal layer SL1-12M. In some embodiments, the sensing portions(e.g., the first sensing portions SP1 of FIG. 10C) may be configured toinclude a metal layer but not a transparent conductive layer.

FIG. 11A is an enlarged plan view illustrating a portion ‘AA’ of FIG. 9.FIG. 11B is an enlarged plan view illustrating a portion ‘BB’ of FIG. 9.For convenience in illustration, the first connecting portion CP1 is notillustrated in FIGS. 11A and 11B.

The portion ‘AA’ shown in FIG. 11A may be defined as a first unit regionAA, which is a part of the input-sensing unit ISU and is used to sensean external input. In the first unit region AA, the first sensorportions SP1 may include a left first sensor portion SP1-1 and a rightfirst sensor portion SP1-2, and the second sensor portions SP2 mayinclude an upper second sensor portion SP2-1 and a lower second sensorportion SP2-2.

Distances between the first sensor portions SP1-1 and SP1-2 and thesecond sensor portions SP2-1 and SP2-2 may be defined as first distancesL1-1, L1-2, L1-3, and L1-4, where L1-1 is the distance between SP1-1 andSP2-1, L1-2 is the distance between SP2-1 and SP 1-2, L1-3 is thedistance between SP1-1 and SP2-2, and L1-4 is the distance between SP2-2and SP1-2. The first distances L1-1, L1-2, L1-3, and L1-4 may havesubstantially the same value, but the inventive concept is not limitedthereto. In some embodiments, at least one of the first distances L1-1,L1-2, L1-3, and L1-4 may be changed, as required.

In the first unit region AA, the first sensor portions SP1-1 and SP1-2and the second sensor portions SP2-1 and SP2-2 may constitute capacitorshaving first capacitance.

For example, the upper second sensor portion SP2-1, in conjunction withthe left first sensor portion SP1-1 and the right first sensor portionSP1-2, may constitute a pair of capacitors having the first capacitance(e.g., where the left first sensor portion SP1-1 and the upper secondsensor portion SP2-1 are the electrodes for one capacitor, and the rightfirst sensor portion SP1-2 and the upper second sensor portion SP2-1 arethe electrodes for the other capacitor), and the lower second sensorportion SP2-2, in conjunction with the left first sensor portion SP1-1and the right first sensor portion SP1-2, may constitute a pair ofcapacitors having the first capacitance (e.g., where the left firstsensor portion SP1-1 and the lower second sensor portion SP2-2 are theelectrodes for one capacitor, and the right first sensor portion SP1-2and the lower second sensor portion SP2-2 are the electrodes for theother capacitor).

The first capacitance may be determined by an area of each of the firstsensor portions SP1-1 and SP1-2 and the second sensor portions SP2-1 andSP2-2 in the first unit region AA and the first distances L1-1, L1-2,L1-3, and L1-4. In detail, the larger the area of each of the firstsensor portions SP1-1 and SP1-2 and the second sensor portions SP2-1 andSP2-2 in the first unit region AA, the greater the first capacitance.Also, the smaller the first distances L1-1, L1-2, L1-3, and L1-4 in thefirst unit region AA, the greater the first capacitance.

In the first unit region AA, the left first sensor portion SP1-1 and theright first sensor portion SP1-2 may have substantially the same area,and the upper second sensor portion SP2-1 and the lower second sensorportion SP2-2 may also have substantially the same area.

Accordingly, in the first unit region AA, the first sensor portionsSP1-1 and SP1-2 and the second sensor portions SP2-1 and SP2-2 mayconstitute capacitors having substantially the same capacitance.

The portion ‘BB’ shown in FIG. 11B may be defined as a second unitregion BB, which is a part of the input-sensing unit ISU and is used tosense an external input.

In the second unit region BB, the left and right first sensor portionsSP1-1 and SP1-2 and the upper and lower second sensor portions SP2-1 andSP2-2 may constitute capacitors having second capacitance.

In FIG. 11B, distances between the first sensor portions SP1-1 and SP1-2and the second sensor portions SP2-1 and SP2-2 may be defined as seconddistances L2-1, L2-2, L2-3, and L2-4, where L2-1 is the distance betweenSP1-1 and SP2-1, L2-2 is the distance between SP2-1 and SP 1-2, L2-3 isthe distance between SP1-1 and SP2-2, and L2-4 is the distance betweenSP2-2 and SP1-2.

Each of the left and right first sensor portions SP1-1 and SP1-2 and theupper second sensor portion SP2-1 shown in FIG. 11B may have a shapewhose top portion is removed, when compared with a corresponding one ofFIG. 11A (e.g., the first sensor portions SP1-1 and SP1-2 and the uppersecond sensor portion SP2-1 have a smaller area than their respectivecounterparts in the first unit region AA).

In the present specification, a sensor portion which has a shape, wherethe majority of the first sensor portions SP1 and second sensor portionsSP2 of the input-sensing unit ISU have substantially the same shape(e.g., the sensor portions SP1-1, SP1-2, SP2-1, and SP2-2 of FIG. 11A),will be referred to as a normal sensor portion. Also, a sensor portionwhich is a part of the input-sensing unit ISU and has an area smallerthan that of the normal sensor portion, (e.g., the sensor portionsSP1-1, SP1-2, and SP2-1 of FIG. 11B) will be referred to as a severedsensor portion. The severed sensor portion may have a shape made bycutting or removing a portion of the shape of the normal sensor portion(e.g., the shape of the severed sensor portion may be substantially thesame as the shape of a first region of the normal sensor portion, butmay omit a second region of the normal sensor portion).

In some embodiments, the normal sensor portion may have a first area,and the severed sensor portion may have a second area. In someembodiments, the ratio of the second area to the first area may rangefrom 0.05 to 0.45. If the ratio of the second area to the first area isless 0.05, it may be difficult to use such an input-sensing unit as asensor. If the ratio of the second area to the first area is greaterthan 0.45, there may be no difference in input-sensing ability betweenthe severed sensor portion and the normal sensor portion.

An area of each of the second sensor portions SP2-1 and SP2-2 and theright first sensor portion SP1-2 shown in FIG. 11B may be smaller thanan area of a corresponding one in FIG. 11A.

Thus, the second capacitance in FIG. 11B may be less than the firstcapacitance in FIG. 11A if the second distances L2-1, L2-2, L2-3, andL2-4 are the same as the first distances L1-1, L1-2, L1-3, and L1-4, andthis loss in capacitance may be compensated by adjusting distancesbetween the first sensor portions SP1-1 and SP1-2 and the second sensorportions SP2-1 and SP2-2 in FIG. 11B. In some embodiments, the seconddistances L2-1, L2-2, L2-3, and L2-4 may be smaller than the firstdistances L1-1, L1-2, L1-3, and L1-4. By reducing the second distancesL2-1, L2-2, L2-3, and L2-4, it may be possible to compensate for some orall of the loss in capacitance which may occur when the severed sensorportions are formed to have an area smaller than that of a normal sensorportion (e.g., compensate or reduce the difference in capacitance thatwould result if the severed sensor portions having the smaller area wereseparated by a distance equal to the first distances L1-1, L1-2, L1-3,and L1-4.

The second distances L2-1, L2-2, L2-3, and L2-4 may have substantiallythe same value, but the inventive concept is not limited thereto. Insome embodiments, to adjust the second capacitance, at least one of thesecond distances L2-1, L2-2, L2-3, and L2-4 may be different from theothers. For example, since the upper second sensor portion SP2-1 has anarea smaller than that of the lower second sensor portion SP2-2,distances L2-1 and L2-2 between the upper second sensor portion SP2-1and the first sensor portions SP1-1 and SP1-2 may be smaller thandistances L2-3 and L2-4 between the lower second sensor portion SP2-2and the first sensor portions SP1-1 and SP1-2.

In addition, a distance between the first sensor portions SP1-1 andSP1-2 may also affect the sensing sensitivity. For example, a distancebetween the first sensor portions SP1-1 and SP1-2 shown in FIG. 11B maybe smaller than a distance between the first sensor portions SP1-1 andSP1-2 shown in FIG. 11A, and in this case, the sensing sensitivity maybe changed depending on such a change in the capacitance between thefirst sensor portions SP1-1 and SP1-2.

FIG. 12A is an enlarged plan view illustrating a portion ‘AA’ of FIG. 9.FIG. 12B is an enlarged plan view illustrating a portion ‘BB’ of FIG. 9.For convenience in illustration, the first connecting portion CP1 is notillustrated in FIGS. 12A and 12B.

An optical dummy electrode DMP-L is illustrated in FIGS. 12A and 12B.The optical dummy electrode DMP-L may be formed by the same process asthat for the first sensor portions SP1 and the second sensor portionsSP2, and thus, the optical dummy electrode DMP-L and the first andsecond sensor portions SP1 and SP2 may include the same material and mayhave the same stacking structure. The optical dummy electrode DMP-L maybe a floating electrode and may not be electrically connected to thefirst sensor portions SP1 and the second sensor portions SP2. Since theoptical dummy electrode DMP-L is provided, visibility of a boundaryregion between the first sensor portions SP1 and the second sensorportions SP2 may be reduced. Although not shown, input-sensing units ofother embodiments to be described below may be configured to have theoptical dummy electrode DMP-L.

The optical dummy electrode DMP-L of FIG. 12B may have a thicknesssmaller than that of the optical dummy electrode DMP-L of FIG. 12A. Sucha difference in thickness between the optical dummy electrodes DMP-L mayresult from the difference between the first distances L1-1, L1-2, L1-3,and L1-4 and the second distances L2-1, L2-2, L2-3, and L2-4, which wasdescribed with reference to FIGS. 11A and 11B.

FIG. 13 is an enlarged plan view illustrating an alternative embodimentof the portion ‘BB’ of FIG. 9. For convenience in illustration, thefirst connecting portion CP1 is not illustrated in FIG. 13.

Referring to FIG. 11A, the first unit region AA may have a first unitlength UL1 in the first direction DR1 and a second unit length UL2 inthe second direction DR2.

The portion ‘BB’ shown in FIG. 13 may be defined as a second unit regionBB, which is a part of the input-sensing unit ISU and is used to sensean external input. The second unit region BB may have a third unitlength UL3 in the first direction DR1 and a fourth unit length UL4 inthe second direction DR2.

Comparing FIG. 13 with FIG. 11A, the second unit length UL2 may besubstantially equal to the fourth unit length UL4, but the inventiveconcept is not limited thereto. For example, in some embodiments, thesecond unit length UL2 may be different from the fourth unit length UL4.

Comparing FIG. 13 with FIG. 11A, the first unit length UL1 may bedifferent from the third unit length UL3. For example, the third unitlength UL3 may be shorter than the first unit length UL1.

Comparing FIG. 13 with FIG. 11B, the first sensor portions SP1-1 andSP1-2 and the second sensor portions SP2-1 and SP2-2 of FIG. 13 may havea uniform area, compared with the first sensor portions SP1-1 and SP1-2and the second sensor portions SP2-1 and SP2-2 of FIG. 11B. For example,in the example of FIG. 13, the upper second sensor portion SP2-1 mayhave substantially the same area as that of the lower second sensorportion SP2-2, and the left first sensor portion SP1-1 may havesubstantially the same area as that of the right first sensor portionSP1-2. In the case where all of the sensor portions provided at left,right, upper, and lower sides have substantially the same area, thecapacitors, which are formed by the sensor portions in the second unitregion BB, may have substantially the same capacitance. Thus, even ifthe third unit length UL3 of the second unit region BB is shorter thanthe first unit length UL1 as shown in FIG. 13, it may be possible toobtain touch sensitivity in the second unit region BB similar to that ofthe first unit region AA having the first unit length UL1 as shown inFIG. 11A.

Although, in the example of FIG. 13, the sensor portions SP1-1, SP1-2,SP2-1, and SP2-2 in the second unit region BB are adjusted to havesubstantially the same area, capacitances between the sensor portionsSP1-1, SP1-2, SP2-1, and SP2-2 in the second unit region BB may besmaller than capacitances between the sensor portions SP1-1, SP1-2,SP2-1, and SP2-2 in the first unit region AA (e.g., in FIG. 11A). Inthis case, the second distances L2-1, L2-2, L2-3, and L2-4 between thesensor portions SP1-1, SP1-2, SP2-1, and SP2-2 in the second unit regionBB may be adjusted, for example as described above with reference toFIG. 11B.

A change in capacitance which is caused by adjusting the third unitlength UL3 and the second distances L2-1, L2-2, L2-3, and L2-4 in thesecond unit region BB was simulated, and the following tables 1 and 2show the result of the simulation.

TABLE 1 First Distance First Unit Length (L1-1, L1-2, (UL1) L1-3, L1-4)Capacitance Experiment 1 4.333 mm 200 μm 1.003 pF

TABLE 2 Second Distance Third Unit Length (L2-1, L2-2, (UL3) L2-3, L2-4)Capacitance Experiment 2 2.667 mm  75 μm 1.066 pF Experiment 3 2.667 mm100 μm 1.035 pF Experiment 4 2.667 mm 140 μm 0.998 pF

In the table 1, data of the experiment 1 show that, when the first unitlength UL1 in the first unit region AA was set to 4.333 mm and the firstdistances L1-1, L1-2, L1-3, and L1-4 were set to 200 μm, the capacitancewas 1.003 pF.

In the table 2, data of the experiments 2, 3, and 4 show that, when thethird unit length UL3 in the second unit region BB was set to 2.667 mmand the second distances L2-1, L2-2, L2-3, and L2-4 were changed tothree different values of 75 μm, 100 μm, and 140 μm, the capacitance hadvalues of 1.066 pF, 1.035 pF, and 0.998 pF, respectively.

That is, by adjusting an area of the electrodes and a distancetherebetween in the second unit region BB, it may be possible tomaintain the capacitance to a level that is equal or similar to that inthe first unit region BB, even when the third unit length UL3 is smallerthan the first unit length UL1.

FIG. 14 is an enlarged plan view illustrating an alternative embodimentof a portion ‘BB’ of FIG. 9. The portion ‘BB’ shown in FIG. 14 may bedefined as the second unit region BB, which is a part of theinput-sensing unit ISU and is used to sense an external input.

In some embodiments, the second unit region BB may further include anauxiliary electrode SP-S. The auxiliary electrode SP-S may have a rod orbar shape.

The auxiliary electrode SP-S may include the same material as the uppersecond sensor portion SP2-1, but the inventive concept is not limitedthereto.

The auxiliary electrode SP-S may be electrically connected to the uppersecond sensor portion SP2-1. In some embodiments, the upper secondsensor portion SP2-1 may be overlapped with and/or in contact with theauxiliary electrode SP-S.

The auxiliary electrode SP-S may be spaced apart from the first sensorportions SP1-1 and SP1-2 by a distance LL. The auxiliary electrode SP-Sand the first sensor portions SP1-1 and SP1-2, which are separated fromeach other by the distance LL, may constitute capacitors. Thus, theauxiliary electrode SP-S may compensate for or reduce the loss incapacitance which may occur when an area of the upper second sensorportion SP2-1 is smaller than that of the lower second sensor portionSP2-2 (e.g., the capacitance of the capacitors formed between the firstsensor portions SP1-1 and SP1-2 and the upper second sensor portionSP2-1 may be the same as the capacitance of the capacitors formedbetween the first sensor portions SP1-1 and SP1-2 and the lower secondsensor portion SP2-2, even though the area of the upper second sensorportion SP2-1 may be smaller than the area of the lower second sensorportion SP2-2).

A thickness WD of the auxiliary electrode SP-S may be adjusted asrequired, the thickness WD being measured in the second direction DR2.The capacitance of capacitors in the second unit region BB depend on thethickness WD.

A change in capacitance, which is caused by disposing the auxiliaryelectrode SP-S in the second unit region BB and adjusting the thicknessWD, was simulated, and the following table 3 shows the results of thesimulation.

TABLE 3 Condition of Kind of Second Sensor Auxiliary Capaci- PortionElectrode tance Experiment 1 Lower Second Sensor — 1.003 pF Portion(Normal Sensor Portion) Experiment 2 Upper Second Sensor — 0.779 pFPortion (Severed Sensor Portion) Experiment 3 Upper Second SensorThickness WD = 1.052 pF Portion (Severed 13 μm Sensor Portion)Experiment 4 Upper Second Sensor Thickness WD = 1.089 pF Portion(Severed 100 μm Sensor Portion) Experiment 5 Upper Second SensorThickness WD = 1.106 pF Portion (Severed 150 μm Sensor Portion)

In the simulation performed to obtain the data of the table 3, the thirdand fourth unit distances UL3 and UL4 were set to 2.667 mm and 4.333 mm,respectively, the distance LL was set to 0.01 mm, and a length LT wasset to 4.328 mm.

In the table 3, data of the experiment 1 show that capacitance betweenthe lower second sensor portion SP2-2 having the unsevered shape andeach of the first sensor portions SP1-1 and SP1-2 adjacent thereto was1.003 pF. Data of the experiment 2 show that capacitance between theupper second sensor portion SP2-1 having the severed shape and each ofthe first sensor portions SP1-1 and SP1-2 adjacent thereto was 0.779 pF.

In the table 3, data of the experiments 3, 4, and 5 show that in thecase where the thickness WD of the auxiliary electrode was changed tothree different values of 13 μm, 100 μm, and 150 μm, the capacitance hadvalues of 1.052 pF, 1.089 pF, and 1.106 pF, respectively.

In the case where the auxiliary electrode SP-S is connected to thesevered sensor portion, it may be possible to maintain the capacitanceto a level that is equal or similar to that in the first unit region AA,even when the severed sensor portion has an area smaller than that ofthe normal sensor portion.

Although, in the example of FIG. 14, the auxiliary electrode SP-S isprovided in the second unit region BB, in some embodiments, thecapacitances between the sensor portions SP1-1, SP1-2, SP2-1, and SP2-2in the second unit region BB may be smaller than capacitances betweenthe sensor portions SP1-1, SP1-2, SP2-1, and SP2-2 in the first unitregion AA shown in FIG. 11A. In this case, distances between the sensorportions SP1-1, SP1-2, SP2-1, and SP2-2 in the second unit region BB maybe adjusted, for example as described above with reference to FIG. 11B.

FIG. 15A is an enlarged plan view illustrating an alternative embodimentof a portion ‘AA’ of FIG. 9. FIG. 15B is an enlarged plan viewillustrating a portion ‘CC’ of FIG. 15A. FIG. 15C is an enlarged planview illustrating an alternative embodiment of a portion ‘BB’ of FIG. 9.FIG. 15D is an enlarged plan view illustrating a portion ‘DD’ of FIG.15C. FIGS. 15A to 15D illustrate examples in which a first connectingportion CP1-1 is provided in the form of a bridge.

The left first sensor portion SP1-1 and the right first sensor portionSP1-2 may be electrically connected to each other by the firstconnecting portion CP1-1. The first connecting portion CP1-1 may includea plurality of patterns P1, P2, and P3.

A first pattern P1 and a second pattern P2 may be formed from the firstconductive layer IS-CL1 (e.g., see FIG. 10A), and a third pattern P3 maybe formed from the second conductive layer IS-CL2 (e.g., see FIG. 10B).Each of the first pattern P1 and the second pattern P2 may be providedto electrically connect the third pattern P3 to the first sensorportions SP1 through the first connection contact holes CNT-I.

An opening OP-CP2 may be defined in the second connecting portion CP2.

The third pattern P3 may be provided in the opening OP-CP2. The firstpattern P1 and the second pattern P2 may be formed of or include amaterial having lower resistance than that of the third pattern P3. Thethird pattern P3 and the first and second sensor portions SP1 and SP2may be formed by the same process, and thus, they may have the samestacking structure and may include the same material. The third patternP3 and the first and second sensor portions SP1 and SP2 may be formed ofor include a transparent conductive material. The first pattern P1 andthe second pattern P2 may be formed of or include a metallic material.

The first and second patterns P1 and P2 may extend in a diagonaldirection crossing the first and second directions DR1 and DR2. Humanvisual characteristics may make objects in the diagonal direction lessnoticeable or recognizable than in the first and second directions DR1and DR2, and thus, the first pattern P1 and the second pattern P2including the metallic material may be minimally visible or notnoticeable or recognizable to a user.

In the present embodiment, the opening OP-CP2 has been described to bedefined in the second connecting portion CP2, but in some embodiments,the opening OP-CP2 may be defined in the second sensor portion SP2-1 orSP2-2. Here, the third pattern P3 may be provided in the opening definedin the second sensor portion SP2-1 or SP2-2.

An electro-static discharge (ESD) prevention pattern ESD-P may beconnected to each of the left first sensor portion SP1-1 and the rightfirst sensor portion SP1-2.

The electrostatic discharge pattern ESD-P may be connected to the firstsensor portions SP1-1 and SP1-2 through the first connection contactholes CNT-I.

An end of the electrostatic discharge pattern ESD-P may be overlappedwith the second connecting portion CP2. In certain embodiments, an endof the electrostatic discharge pattern ESD-P may be overlapped with thesecond sensor portion SP2-1 or SP2-2.

A vertex for easily causing an electrostatic discharge phenomenon (e.g.,for having a lower threshold for electrostatic discharge) may be formedat the end of the electrostatic discharge pattern ESD-P. In other words,the electrostatic discharge pattern ESD-P may be shaped like a needle,and a sharp portion of the electrostatic discharge pattern ESD-P may beplaced to be overlapped with the second connecting portion CP2 or thesecond sensor portion SP2-1 or SP2-2. In the electrostatic dischargepattern ESD-P, the electrostatic discharge phenomenon may be induced bythe vertex, and this may make it possible to prevent the firstconnecting portion CP1-1 from being cut or damaged.

Referring to FIG. 15B, the first pattern P1 or the second pattern P2 mayhave a first pattern width WD-PN1. Referring to FIG. 15D, the firstpattern P1 or the second pattern P2 may have a second pattern widthWD-PN2. In some embodiments, the second pattern width WD-PN2 may belarger than the first pattern width WD-PN1.

Capacitance between the first and second patterns P1 and P2 (e.g., seeFIG. 15D) having the second pattern width WD-PN2 and an electrodeoverlapped therewith may be greater than capacitance between the firstand second patterns P1 and P2 (e.g., see FIG. 15B) having the firstpattern width WD-PN1 and an electrode overlapped therewith. Thus, in theexample of FIG. 15C, if the second pattern width WD-PN2 is larger thanthe first pattern width WD-PN1, it may be possible to compensate forsome or all of the loss in capacitance which is caused by the severedsensor portion (i.e., the upper second sensor portion SP2-1) as comparedto the normal portion.

Referring to FIG. 15B, the electrostatic discharge pattern ESD-P mayhave a first prevention pattern width WD-EN1. Referring to FIG. 15D, theelectrostatic discharge pattern ESD-P may have a second preventionpattern width WD-EN2. In some embodiments, the second prevention patternwidth WD-EN2 may be larger than the first prevention pattern widthWD-EN1.

Capacitance between the electrostatic discharge pattern ESD-P (e.g., seeFIG. 15D) having the second prevention pattern width WD-EN2 and anelectrode overlapped therewith may be greater than capacitance betweenthe electrostatic discharge pattern ESD-P (e.g., see FIG. 15B) havingthe first prevention pattern width WD-EN1 and an electrode overlappedtherewith. Thus, in the example of FIG. 15C, if the second preventionpattern width WD-EN2 is larger than the first prevention pattern widthWD-EN1, it may be possible to compensate for some or all of the the lossin capacitance which is caused by the severed sensor portion (i.e., theupper second sensor portion SP2-1) as compared to the normal portion.

FIG. 16 is a plan view illustrating an input-sensing unit ISU accordingto some embodiments of the inventive concept. The input-sensing unit ISUof FIG. 16 may differ from that of FIG. 9 in terms of a position of thesecond unit region BB. In the example of FIG. 9, the electrodes may bearranged with reference to the second sensing electrodes 1E2-2 and 1E2-3which are short in the first direction DR1, and thus, the severed sensorportion may be formed at end portions of the long second electrodes1E2-1 and 1E2-4. By contrast, in the example of FIG. 16, the electrodesmay be arranged with reference to the second sensing electrodes 1E2-1and 1E2-4 which are long in the first direction DR1, and thus, thesevered sensor portion may be formed at end portions of the short secondelectrodes 1E2-2 and 1E2-3.

Except for the above features, the first and second unit regions AA andBB of FIG. 16 may be configured to be substantially the same as those ofthe previous embodiments described with reference to FIGS. 9 to 15D, andmay function or be configured as described above with reference to thoseembodiments.

FIG. 17 is a plan view illustrating an input-sensing unit ISU accordingto some embodiments of the inventive concept. In the above-describedembodiments, the severed sensor portion is formed at an upper portion ofthe second unit region BB (e.g., the severed sensor portion or portionswere considered severed based on a missing region at the upper portionof the unit region BB), but as shown in FIG. 17, the severed sensorportion may be formed at a right portion of the second unit region BB(e.g., the severed sensor portion or portions may be considered severedbased on a missing region at the right portion of the unit region BB).However, the inventive concept is not limited thereto, and in someembodiments, the severed sensor portion may be formed at a left portionof the second unit region BB.

FIG. 18A is an enlarged plan view illustrating a portion ‘AA’ of FIG.17. FIG. 18B is an enlarged plan view illustrating a portion ‘BB’ ofFIG. 17. For convenience in illustration, the first connecting portionCP1 is not illustrated in FIGS. 18A and 18B.

The portion ‘AA’ shown in FIG. 18A may be defined as a first unit regionAA, which is a part of the input-sensing unit ISU and is used to sensean external input. In the first unit region AA, the first sensorportions SP1-1 and SP1-2 and the second sensor portions SP2-1 and SP2-2may constitute capacitors having first capacitance. The remainingportion of FIG. 18A may be substantially the same as that described withreference to FIG. 11A, and a detailed description thereof will beomitted.

Referring to FIG. 18B, in the second unit region BB, the first sensorportions SP1-1 and SP1-2 and the second sensor portions SP2-1 and SP2-2may constitute capacitors having second capacitance.

In FIG. 18B, distances between the first sensor portions SP1-1 and SP1-2and the second sensor portions SP2-1 and SP2-2 may be defined as thesecond distances L2-1, L2-2, L2-3, and L2-4, where L2-1 is the distancebetween SP1-1 and SP2-1, L2-2 is the distance between SP2-1 and SP 1-2,L2-3 is the distance between SP1-1 and SP2-2, and L2-4 is the distancebetween SP2-2 and SP1-2.

Each of the second sensor portions SP2-1 and SP2-2 and the right firstsensor portion SP1-2 shown in FIG. 18B may have a partially cut orsevered shape (e.g., a shaped with a reduced area), compared with acorresponding one of the first sensor portions SP1-1 and SP1-2 and thesecond sensor portion SP2-1 shown in FIG. 18A. That is, in FIG. 18B, thesecond sensor portions SP2-1 and SP2-2 and the right first sensorportion SP1-2 may be severed sensor portions.

An area of each of the second sensor portions SP2-1 and SP2-2 and theright first sensor portion SP1-2 shown in FIG. 18B may be smaller thanan area of a corresponding one in FIG. 18A.

Thus, the second capacitance in FIG. 18B may be less than the firstcapacitance in FIG. 18A if the second distances L2-1, L2-2, L2-3, andL2-4 are the same as the first distances L1-1, L1-2, L1-3, and L1-4, andthis loss in capacitance may be compensated by adjusting distancesbetween the first sensor portions SP1-1 and SP1-2 and the second sensorportions SP2-1 and SP2-2 in FIG. 18B. In some embodiments, the seconddistances L2-1, L2-2, L2-3, and L2-4 may be smaller than the firstdistances L1-1, L1-2, L1-3, and L1-4. By reducing the second distancesL2-1, L2-2, L2-3, and L2-4, it may be possible to compensate for some orall of the loss in capacitance which may occur when the severed sensorportions are formed to have an area smaller than that of a normal sensorportion.

The second distances L2-1, L2-2, L2-3, and L2-4 may have substantiallythe same value, but the inventive concept is not limited thereto. Insome embodiments, to adjust the second capacitance, at least one of thesecond distances L2-1, L2-2, L2-3, and L2-4 may be different from theothers. For example, since the right first sensor portion SP1-2 has anarea smaller than that of the left first sensor portion SP1-1, thesecond distances L2-2 and L2-4 between the right first sensor portionSP1-2 and the second sensor portions SP2-1 and SP2-2 may be smaller thandistances L2-1 and L2-3 between the left first sensor portion SP1-1 andthe second sensor portions SP2-1 and

SP2-2.

Each or both of the first and second unit regions AA and BB of FIG. 17may be configured to include the optical dummy electrode DMP-L, as shownin FIGS. 12A and 12B.

FIG. 19 is an enlarged plan view illustrating an alternative embodimentof the portion ‘BB’ of FIG. 17. For convenience in illustration, thefirst connecting portion CP1 is not illustrated in FIG. 19.

Referring to FIG. 18A, the first unit region AA may have the first unitlength UL1 in the first direction DR1 and the second unit length UL2 inthe second direction DR2.

Referring to FIG. 19, the second unit region BB may have the third unitlength

-   -   UL3 in the first direction DR1 and the fourth unit length UL4 in        the second direction DR2.

Comparing FIG. 19 with FIG. 18A, the first unit length UL1 may besubstantially equal to the third unit length UL3. However, the inventiveconcept is not limited thereto. In some embodiments, the first unitlength UL1 may be different from the third unit length UL3.

Comparing FIG. 19 with FIG. 18A, the second unit length UL2 may bedifferent from the fourth unit length UL4. For example, the fourth unitlength UL4 may be shorter than the second unit length UL2.

Comparing FIG. 19 with FIG. 18B, the first sensor portions SP1-1 andSP1-2 and the second sensor portions SP2-1 and SP2-2 of FIG. 19 may havea uniform area, compared with the first sensor portions SP1-1 and SP1-2and the second sensor portions SP2-1 and SP2-2 of FIG. 18B. For example,in the example of FIG. 19, the upper second sensor portion SP2-1 mayhave substantially the same area as that of the lower second sensorportion SP2-2, and the left first sensor portion SP1-1 may havesubstantially the same area as that of the right first sensor portionSP1-2. In the case where all of the sensor portions provided at left,right, upper, and lower sides have substantially the same area, thecapacitors which are formed by the sensor portions in the second unitregion BB may have substantially the same capacitance. Accordingly, evenif the fourth unit length UL4 of the second unit region BB is shorterthan the second unit length UL2 as shown in FIG. 19, it may be possibleto obtain touch sensitivity in the second unit region BB similar to thatof the first unit region AA having the second unit length UL2 as shownin FIG. 18A.

Although, in the example of FIG. 19, the sensor portions SP1-1, SP1-2,SP2-1, and SP2-2 in the second unit region BB are adjusted to havesubstantially the same area, capacitances between the sensor portionsSP1-1, SP1-2, SP2-1, and

SP2-2 in the second unit region BB may be smaller than capacitancesbetween the sensor portions SP1-1, SP1-2, SP2-1, and SP2-2 in the firstunit region AA shown in FIG. 18A. In this case, the second distancesL2-1, L2-2, L2-3, and L2-4 between the sensor portions SP1-1, SP1-2,SP2-1, and SP2-2 in the second unit region BB may be adjusted, forexample by reducing the second distances L2-1, L2-2, L2-3, and L2-4 toreduce or eliminate the difference in capacitance between the secondcapacitance of FIG. 19 and the first capacitance of FIG. 18A.

FIG. 20 is an enlarged plan view illustrating an alternative embodimentof a portion ‘BB’ of FIG. 17.

In some embodiments, the second unit region BB may further include theauxiliary electrode SP-S. The auxiliary electrode SP-S may beelectrically connected to the right first sensor portion SP1-2. Forexample, the right first sensor portion SP1-2 may be overlapped withand/or in contact with the auxiliary electrode SP-S.

The auxiliary electrode SP-S may be spaced apart from the second sensorportions SP2-1 and SP2-2 by a distance LL. Accordingly, the auxiliaryelectrode SP-S, in conjunction with the second sensor portions SP2-1 andSP2-2, may constitute a capacitor having a specific capacitance. Thus,the auxiliary electrode SP-S may compensate for or reduce the loss incapacitance which may occur when the area of the right first sensorportion SP1-2 is smaller than that of the left first sensor portionSP1-1 (e.g., the capacitance of the capacitors formed between the secondsensor portions SP2-1 and SP2-2 and the right first sensor portion SP1-2may be the same as the capacitance of the capacitors formed between thesecond sensor portions SP2-1 and SP2-2 and the left first sensor portionSP1-1, even though the area of the right first sensor portion SP1-2 maybe smaller than the area of the left first sensor portion SP1-1).

Except for the above features, the auxiliary electrode SP-S of FIG. 20may be substantially the same as that described with reference to FIG.14.

In some embodiments, the first and second unit regions AA and BB of FIG.17 may include the first connecting portion CP1-1 and the electrostaticdischarge pattern ESD-P described with reference to FIGS. 15A to 15D.

FIG. 21 is a plan view illustrating an input-sensing unit ISU accordingto some embodiments of the inventive concept. In some embodiments, thesecond unit region BB may include a severed sensor portion having acurved shape.

FIG. 22A is an enlarged plan view illustrating a portion ‘AA’ of FIG.21. FIG. 22B is an enlarged plan view illustrating a portion ‘BB’ ofFIG. 21. For convenience in illustration, the first connecting portionCP1 is not illustrated in FIGS. 22A and 22B.

The portion ‘AA’ shown in FIG. 22A may be defined as a first unit regionAA, which is a part of the input-sensing unit ISU and is used to sensean external input. In the first unit region AA, the first sensorportions SP1-1 and SP1-2 and the second sensor portions SP2-1 and SP2-2may constitute capacitors having a first capacitance. Except for theabove features, the structure of FIG. 24A may be substantially the sameas that described with reference to FIG. 11A.

Referring to FIG. 22B, in the second unit region BB, the first sensorportions

SP1-1 and SP1-2 and the second sensor portions SP2-1 and SP2-2 mayconstitute capacitors having a second capacitance.

In FIG. 22B, distances between the first sensor portions SP1-1 and SP1-2and the second sensor portions SP2-1 and SP2-2 may be defined as thesecond distances L2-1, L2-2, L2-3, and L2-4, where L2-1 is the distancebetween SP1-1 and SP2-1, L2-2 is the distance between SP2-1 and SP 1-2,L2-3 is the distance between SP1-1 and SP2-2, and L2-4 is the distancebetween SP2-2 and SP1-2.

Each of the left first sensor portion SP1-1 and the upper second sensorportion SP2-1 shown in FIG. 22B may have a partially cut or severedshape, compared with a corresponding one of the left first sensorportion SP1-1 and the upper second sensor portion SP2-1 shown in FIG.22A. That is, in FIG. 22B, the left first sensor portion SP1-1 and theupper second sensor portion SP2-1 may be severed sensor portions.

An area of each of the left first sensor portion SP1-1 and the uppersecond sensor portion SP2-1 shown in FIG. 22B may be smaller than anarea of a corresponding one in FIG. 22A.

Thus, the second capacitance in FIG. 22B may be less than the firstcapacitance in FIG. 22A if the second distances L2-1, L2-2, L2-3, andL2-4 are the same as the first distances L1-1, L1-2, L1-3, and L1-4, andthis loss in capacitance may be compensated by adjusting distancesbetween the first sensor portions SP1-1 and

SP1-2 and the second sensor portions SP2-1 and SP2-2 in FIG. 22B. Insome embodiments, the second distances L2-1, L2-2, L2-3, and L2-4 may besmaller than the first distances L1-1, L1-2, L1-3, and L1-4. By reducingthe second distances L2-1, L2-2, L2-3, and L2-4, it may be possible tocompensate for some or all of the loss in capacitance which may occurwhen the severed sensor portions are formed to have an area smaller thanthat of a normal sensor portion.

The second distances L2-1, L2-2, L2-3, and L2-4 may have substantiallythe same value, but the inventive concept is not limited thereto. Insome embodiments, to adjust the second capacitance, at least one of thesecond distances L2-1, L2-2, L2-3, and L2-4 may be different from theothers. For example, since the left first sensor portion SP1-1 and theupper second sensor portion SP2-1 have areas smaller than those of theright first sensor portion SP1-2 and the lower second sensor portionSP2-2, the second distances L2-1, L2-2, and L2-3 between the left firstand upper second sensor portions SP1-1 and SP2-1 and the neighboringsensor portions may be smaller than the distance L2-4 between the rightfirst sensor portion SP1-2 and the lower second sensor portion SP2-2.

In some embodiments, each or both of the first and second unit regionsAA and BB of FIG. 21 may be configured to include the optical dummyelectrode DMP-L, as shown in FIGS. 12A and 12B.

FIG. 23 is an enlarged plan view illustrating an alternative embodimentof the portion ‘BB’ of FIG. 21. For convenience in illustration, thefirst connecting portion CP1 is not illustrated in FIG. 23.

Comparing FIG. 23 with FIG. 22A, a total area of the sensor portionsSP1-1, SP1-2, SP2-1, and SP2-2 provided in the second unit region BB maybe smaller than a total area of the sensor portions SP1-1, SP1-2, SP2-1,and SP2-2 provided in the first unit region AA.

Comparing FIG. 23 with FIG. 22B, the first sensor portions SP1-1 andSP1-2 and the second sensor portions SP2-1 and SP2-2 of FIG. 23 may havea uniform area, compared with the first sensor portions SP1-1 and SP1-2and the second sensor portions SP2-1 and SP2-2 of FIG. 22B. For example,in the example of FIG. 23, the upper second sensor portion SP2-1 mayhave substantially the same area as that of the lower second sensorportion SP2-2, and the left first sensor portion SP1-1 may havesubstantially the same area as that of the right first sensor portionSP1-2. In the case where all of the sensor portions provided at left,right, upper, and lower sides have substantially the same area, thecapacitors which are formed by the sensor portions in the second unitregion BB may have substantially the same capacitance. Thus, althoughthe total area of the sensor portions SP1-1, SP1-2, SP2-1, and SP2-2provided in the second unit region BB is smaller than the total area ofthe sensor portions SP1-1, SP1-2, SP2-1, and SP2-2 provided in the firstunit region AA, the second unit region BB may provide touch sensitivitysimilar to that of the first unit region AA.

Although, in the example of FIG. 23, the sensor portions SP1-1, SP1-2,SP2-1, and SP2-2 in the second unit region BB are adjusted to havesubstantially the same area, capacitances between the sensor portionsSP1-1, SP1-2, SP2-1, and

SP2-2 in the second unit region BB may be smaller than capacitancesbetween the sensor portions SP1-1, SP1-2, SP2-1, and SP2-2 in the firstunit region AA shown in FIG. 22A. In this case, the second distancesL2-1, L2-2, L2-3, and L2-4 between the sensor portions SP1-1, SP1-2,SP2-1, and SP2-2 in the second unit region BB may be adjusted, forexample by reducing the second distances L2-1, L2-2, L2-3, and L2-4 toreduce or eliminate the difference in capacitance between the secondcapacitance of FIG. 23 and the first capacitance of FIG. 22A.

FIG. 24 is an enlarged plan view illustrating an alternative embodimentof a portion ‘BB’ of FIG. 21.

In some embodiments, the second unit region BB may further include theauxiliary electrodes SP-S. The auxiliary electrodes SP-S may beelectrically connected to the left first sensor portion SP1-1 and/or theupper second sensor portion SP2-1, respectively. For example, each ofthe left first sensor portion SP1-1 and the upper second sensor portionSP2-1 may be overlapped with and/or in contact with a corresponding oneof the auxiliary electrodes SP-S.

The auxiliary electrodes SP-S may be spaced apart from the left firstsensor portion SP1-1 and the upper second sensor portion SP2-1 by adistance LL. Accordingly, the auxiliary electrodes SP-S, in conjunctionwith the left first sensor portion SP1-1 and the upper second sensorportion SP2-1, may constitute capacitors having specific capacitance.Thus, the auxiliary electrode SP-S may compensate for or reduce the lossin capacitance which may occur when areas of the left first sensorportion SP1-1 and the upper second sensor portion SP2-1 are smaller thanthose of the right first sensor portion SP1-2 and the lower secondsensor portion SP2-2.

Except for the above features, the auxiliary electrodes SP-S of FIG. 24may be substantially the same as that described with reference to FIG.14.

In some embodiments, each or both of the first and second unit regionsAA and BB of FIG. 21 may be configured to include the first connectingportion CP1-1 and the electrostatic discharge pattern ESD-P describedwith reference to FIGS. 15A to 15D.

FIG. 25 is a plan view illustrating an input-sensing unit ISU accordingto some embodiments of the inventive concept. FIG. 26 is a sectionalview taken along line III-Ill′ of FIG. 25.

FIG. 25 illustrates an example of the input-sensing unit ISU in whichsome of the sensor portions SP1 and SP2 connected to the signal linesSL1-1 to SL1-5 and SL2-1 to SL2-4 are provided to form a curved shape.Signal lines SL1-1 and SL1-2, which are connected to the first sensorportions SP1 forming the curved shape, may have a shape (e.g., a curvedshape) corresponding to the curved shape.

The input-sensing unit ISU may include an extension electrode SP2-Eelectrically connected to the second sensor portion SP2 (e.g., one ofthe second sensor portions SP2 provided to form the curved shape).

In some embodiments, the extension electrode SP2-E and the second sensorportion SP2 may form a single body. In other words, the extensionelectrode SP2-E may be an extended portion of the second sensor portionSP2. However, the inventive concept is not limited thereto, and in someembodiments, the extension electrode SP2-E and the second sensor portionSP2 may be separate elements. In this case, the extension electrodeSP2-E may be formed by a separate process, and then it may beelectrically connected to the second sensor portion SP2.

Referring to FIG. 26, the extension electrode SP2-E may be overlappedwith the signal line SL1-1. The extension electrode SP2-E and the signalline SL1-1 may be spaced apart from each other by a distance LL-1,thereby forming a capacitor.

Areas of the sensor portions SP1 and SP2 may be smaller in the secondunit region BB than in the first unit region AA, and this may lead to adifference in touch sensitivity. The capacitor which is formed by theextension electrode SP2-E and the signal line SL1-1 may be used (e.g.,configured) to compensate for some or all of such a difference in touchsensitivity.

FIGS. 25 and 26 illustrate an example in which the extension electrodeSP2-E is electrically connected to the second sensor portion SP2 and isoverlapped with at least one of the signal lines, but the inventiveconcept is not limited thereto. In certain embodiments, the extensionelectrode may be electrically connected to the first sensor portion andmay be overlapped with at least one of the signal lines.

FIG. 27 illustrates an input-sensing region ISA according to someembodiments of the inventive concept.

Referring to FIG. 27, each corner of the input-sensing region ISA mayhave a rounded edge RD. FIG. 27 illustrates an example in which all ofthe four corners of the input-sensing region ISA have the rounded edgeRD, but the inventive concept is not limited thereto. In certainembodiments, only at least one of the corners may have the rounded edgeRD.

Due to the presence of the rounded edge RD, at least one of the sensorportions SP1 and SP2 may have an area that is smaller than the others.The methods in the above-described embodiments may be used to compensatefor some or all of the reduction in capacitance which may be caused bythe rounded edge RD.

An opening OP-ISA may be defined in the input-sensing region ISA. A sizeand a position of the opening OP-ISA may be changed.

Due to the presence of the opening OP-ISA, at least one of the sensorportions SP1 and SP2 may have an area that is smaller than the others.Similarly, the methods in the above-described embodiments may be used tocompensate for some or all of the reduction in capacitance which may becaused by the opening OP-ISA.

FIG. 28 illustrates an input-sensing region ISA and afingerprint-sensing region FPA according to some embodiments of theinventive concept.

In some embodiments, a round portion, a cut portion, an opening, and/orso forth may be defined in the input-sensing region ISA, and thefingerprint-sensing region FSA may be defined to be adjacent thereto(e.g., disposed within the round portion, the cut portion, or theopening. The fingerprint-sensing region FPA may be configured to sense auser's fingerprint and may be used for security purposes (e.g., tounlock the display device DD or a device including or utilizing thedisplay device DD).

The fingerprint-sensing region FPA is illustrated in FIG. 28, but theinventive concept is not limited thereto. In certain embodiments, theregion which is adjacent to the round portion, the cut portion, or theopening of the input-sensing region ISA may be used for other purposes.

FIG. 29A is a plan view illustrating an input-sensing unit ISU accordingto some embodiments of the inventive concept. FIG. 29B is a sectionalview taken along line IV-IV′ of FIG. 29A.

In the previous embodiments, the first sensor portion SP1 and the secondsensor portion SP2 are illustrated to be placed on the same layer or atthe same level, but in some embodiments, the first sensor portion SP1and the second sensor portion SP2 may be placed on different layers orat different levels, as shown in FIGS. 29A and 29B. Accordingly, thefirst sensor portion SP1 and the second sensor portion SP2 mayconstitute capacitors.

Since the first sensor portion SP1 and the second sensor portion SP2 areplaced on different layers from each other, the stacking structure ofthe signal lines SL1-1 to SL1-5 and SL2-1 to SL2-4 may be changed.

FIG. 29B illustrates an example, in which the first insulating layerIS-IL1 is formed to have a flat top surface, but in some embodiments,the first insulating layer IS-IL1 may be formed to have a stepwiseportion. In the present embodiment, refractive indices of the first andsecond insulating layers IS-IL1 and IS-IL2 may be adjusted to reduce adifference in reflectance between the first sensing electrodes 1E1-1 to1E1-5 and the second sensing electrodes 1E2-1 to 1E2-4 placed ondifferent layers from each other.

The first insulating layer IS-IL1 may have a refractive index that isclose to that of the first sensing electrodes 1E1-1 to 1E1-5. The secondinsulating layer IS-IL2 may have a refractive index that is less thanthat of the first insulating layer IS-IL1. For example, in the casewhere the first sensing electrodes 1E1-1 to 1E1-5 are ITO electrodes,the first insulating layer IS-IL1 may have a refractive index rangingfrom 1.7 to 1.8 (for light having a wavelength of 550 nm), and thesecond insulating layer IS-IL2 may have a refractive index between thoseof the air and the first insulating layer IS-IL1 (e.g., 1.5 to 1.65).

In the case where the first and second insulating layers IS-IL1 andIS-IL2 having different refractive indices are provided on the sensingelectrodes, it may be possible to reduce reflectance of external lightand to reduce a difference in reflectance between the first sensingelectrodes 1E1-1 to 1E1-5 and the second sensing electrodes 1E2-1 to1E2-4 placed on different layers.

FIG. 30 is a perspective view illustrating an input-sensing unit ISUaccording to some embodiments of the inventive concept. For conveniencein illustration, only the sensor portions SP1 and SP2 and the connectingportions CP1 and CP2 of the input-sensing unit ISU are illustrated inFIG. 30.

The input-sensing unit ISU may include a planar portion ISU-N andprotruding portions ISU-P. At least one of the protruding portions ISU-Pmay be at an angle θc (hereinafter, a bending angle) relative to theplanar portion ISU-N. The bending angle θc may be a fixed value or avariable value. The bending angle θc may be adjusted to realize theinput-sensing unit ISU in various shapes (e.g., the protruding portionISU-P may be movable with respect to the planar portion ISU-N).

FIGS. 31 and 32 illustrate display devices DD1, DD2, and DD3 accordingto some embodiments of the inventive concept. Various display devicesDD1 and DD2 may be used in a car.

As an example, FIG. 31 illustrates a display device DD1, which is usedas a part of an embedded navigation system, and a display device DD2,which is placed near a gear lever.

The shapes of the display devices DD1 and DD2 may be changed, dependingon the car design. For example, the display device may be configured tohave rounded corners (e.g., as in the display device DD1 for theembedded navigation system) or a severed top portion (e.g., as in thedisplay device DD2 near the gear lever).

In addition, although not shown, a rounded display device may be usedfor a dashboard of a car.

If the above-described input-sensing unit ISU is used for the displaydevices DD1 and DD2, it may be possible to improve an input-sensingability of the display devices DD1 and DD2.

Referring to FIG. 32, the display device DD3 may be a wearable devicethat can be worn on the human body. In FIG. 32, a clock-type device isillustrated as an example of the display device DD3, but the inventiveconcept is not limited thereto. A shape of the display device DD3 may bevariously changed to be worn on the human body.

To allow the wearable device to be worn on the human body, a shape ofthe display region DD-DA may be changed, as required. If theabove-described input-sensing unit ISU is used for the display deviceDD3, it may be possible to improve an input-sensing ability of thedisplay device DD3.

According to some embodiments of the inventive concept, a display devicemay include an input-sensing unit, in which capacitance between sensorsis uniformly controlled.

Accordingly, it may be possible to achieve high uniformity in sensingsensitivity between the sensors of the input-sensing unit.

In addition, even when there is a change in shape of the sensors, it maybe possible to secure uniform sensing sensitivity. Thus, the shapes ofthe sensors may be variously changed.

While example embodiments of the inventive concepts have beenparticularly shown and described, it will be understood by one ofordinary skill in the art that variations in form and detail may be madetherein without departing from the spirit and scope of the attachedclaims and their equivalents.

What is claimed is:
 1. A display device comprising: a display panel; andan input-sensing unit on the display panel, wherein the input-sensingunit comprises: a plurality of first electrodes extending in a firstdirection; and a plurality of second electrodes extending in a seconddirection crossing the first direction, wherein each of the plurality offirst electrodes comprises a plurality of first sensor portions and aplurality of first connecting portions connecting the plurality of firstsensor portions to each other, wherein each of the plurality of secondelectrodes comprises a plurality of second sensor portions and aplurality of second connecting portions connecting the plurality ofsecond sensor portions to each other, and wherein the plurality of firstsensor portions of one of the plurality of first electrodes comprises: afirst normal sensor portion having a first area and being spaced apartfrom an adjacent one of the second sensor portions by a first distance;and a first severed sensor portion having a second area different fromthe first area and being spaced apart from an adjacent one of the secondsensor portions by a second distance that is different from the firstdistance.
 2. The display device of claim 1, wherein the first severedsensor portion has a shape which can be made by removing a portion of ashape of the first normal sensor portion, and the second area is smallerthan the first area, and the second distance is smaller than the firstdistance.
 3. The display device of claim 2, wherein the second area isless than or larger than half of the first area.
 4. The display deviceof claim 2, wherein the plurality of first sensor portions of the one ofthe first electrodes comprises a plurality of first normal sensorportions comprising the first normal sensor portion, wherein theplurality of first normal sensor portions are arranged in the firstdirection, and wherein the first severed sensor portion is outside theplurality of first normal sensor portions in the first direction.
 5. Thedisplay device of claim 1, further comprising an optical dummy electrodelocated between the plurality of first sensor portions and the pluralityof second sensor portions and electrically disconnected from theplurality of first sensor portions and the plurality of second sensorportions, wherein a width of the optical dummy electrode between thefirst severed sensor portion and one of the plurality of second sensorportions that is adjacent to the first severed sensor portion is smallerthan a width of the optical dummy electrode between the first normalsensor portion and one of the plurality of second sensor portions thatis adjacent to the first normal sensor portion.
 6. The display device ofclaim 4, wherein a length from an end of the first severed sensorportion to another end of a first sensor portion adjacent to the firstsevered sensor portion measured in the first direction is smaller than alength from an end of a first normal sensor portion of the plurality offirst normal sensor portions to another end of a first sensor portionadjacent to the first normal sensor portion measured in the firstdirection, and an area of the first sensor portion adjacent to the firstsevered sensor portion is substantially the same as the second area. 7.The display device of claim 1, wherein the plurality of first electrodescomprises another first electrode with a length in the first directionthat is different from a length in the first direction of the one of thefirst electrodes, and which includes a plurality of first sensorportions, and the plurality of first sensor portions of the anotherfirst electrode comprise: a second normal sensor portion having thefirst area; and a second severed sensor portion having a third areadifferent from the first area and the second area.
 8. The display deviceof claim 7, wherein an end of the first severed sensor portion isconnected to an end of an adjacent one of the plurality of first sensorportions of the one of the first electrodes by a corresponding one ofthe first connecting portions, an end of the second severed sensorportion is connected to an end of an adjacent one of the plurality offirst sensor portions of the another first electrode by a correspondingone of the first connecting portions, and a length from another end ofthe first severed sensor portion to another end of the adjacent one ofthe plurality of first sensor portions of the one of the firstelectrodes is smaller than a length from another end of the secondsevered sensor portion to another end of the adjacent one of theplurality of first sensor portions of the another first electrode. 9.The display device of claim 7, wherein the third area is half the firstarea.
 10. The display device of claim 1, further comprising an auxiliaryelectrode connected to the first severed sensor portion, wherein a sideedge of the auxiliary electrode faces a side edge of one of theplurality of second sensor portions that is adjacent to the firstsevered sensor portion.
 11. The display device of claim 10, wherein theauxiliary electrode has a rod shape, and a length of the auxiliaryelectrode is smaller than a width of the first normal sensor portion.12. The display device of claim 1, wherein the second area is smallerthan the first area, and the second distance is smaller than the firstdistance.
 13. The display device of claim 1, wherein the first normalsensor portion is spaced apart from an adjacent one of the second sensorportions by the first distance, and the first severed sensor portion isspaced apart from an adjacent one of the second sensor portions by thesecond distance that is smaller than the first distance.
 14. A displaydevice comprising: a display panel; and an input-sensing unit on thedisplay panel, wherein the input-sensing unit comprises: a plurality offirst electrodes extending in a first direction; and a plurality ofsecond electrodes extending in a second direction crossing the firstdirection, wherein each of the plurality of first electrodes comprises aplurality of first sensor portions and a plurality of first connectingportions connecting the plurality of first sensor portions to eachother, wherein each of the plurality of second electrodes comprises aplurality of second sensor portions and a plurality of second connectingportions connecting the plurality of second sensor portions to eachother, and wherein the plurality of first sensor portions of one of theplurality of first electrodes comprises: a first normal sensor portionhaving a first area and being spaced apart from an adjacent one of thesecond sensor portions by a first distance; and a first severed sensorportion having a second area different from the first area and beingspaced apart from an adjacent one of the second sensor portions by asecond distance that is different from the first distance, and whereinat least one of edges of the first severed sensor portion has apredetermined curvature.